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pro vyhledávání: '"W.C. Machon"'
Publikováno v:
Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).
Improvements in PCB technology and the demand for smaller form factor at lower cost have provided the primary motivation for interest in flip chip on board (FCOB) assembly. With the development of direct chip attach (DCA) technology using high-lead s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b3c898719028ca1eafe82e1eff5bd93
https://doi.org/10.1109/isapm.1998.664445
https://doi.org/10.1109/isapm.1998.664445
Publikováno v:
Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).
Packaging of electronic components is in a transitional phase due to the relentless progress of transistor integration that is going on in the semiconductor environment. While all manufacturers may want to transition directly to flip chip, for a numb
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f05aad4e5ff470094f831a3a4f26a8d
https://doi.org/10.1109/isapm.1998.664436
https://doi.org/10.1109/isapm.1998.664436
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