Zobrazeno 1 - 10
of 15
pro vyhledávání: '"W. Ziemlich"'
Publikováno v:
Microelectronic Engineering. 20:171-183
Laser-induced removal of particles from surfaces was demonstrated. Such “laser cleaning” can be performed on the bare contaminated surface or with additional micronthickness liquid film coverage on the surface. With the latter “steam laser clea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::585d062057b7487baaaf6aa4872f0512
https://doi.org/10.1016/0167-9317(93)90214-p
https://doi.org/10.1016/0167-9317(93)90214-p
Publikováno v:
Advanced Materials for Optics and Electronics. 2:63-70
Pulsed-laser-induced removal of particles from surfaces is a new cleaning technique. This laser cleaning can be performed on dry surfaces as well as on wet surfaces with a micron-thick liquid film during pulsed laser irradiation to provide enhanced r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e456eafb97f37fd15da01b4cfcb4dae1
https://doi.org/10.1002/amo.860020108
https://doi.org/10.1002/amo.860020108
Publikováno v:
Microelectronic Engineering. 17:473-478
‘Liquid Film Enhanced Laser Cleaning” is a technique to remove particulate contamination from surfaces. A thin liquid film deposited onto the contaminated surface is flood irradiated with a short laser pulse. The resulting sudden evaporation of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07ab64073ab6c2dd570661e65db82e0e
https://doi.org/10.1016/0167-9317(92)90097-b
https://doi.org/10.1016/0167-9317(92)90097-b
Autor:
T. Bayer, W. Haug, Klaus Meissner, Werner Dr. Kulcke, U. Behringer, Harald Bohlen, G. Sasso, Peter Vettiger, W. Ziemlich, Hugo E. Rothuizen
Publikováno v:
Microelectronic Engineering. 13:361-364
Following the trends in the semiconductor technology to higher density and smaller dimensions the light-optical tools get serious technical problems to solve the requirements on resolution, depth of focus and overlay. Besides exposure tools using DUV
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8082f3b6d996955060036dc6ec29aa4e
https://doi.org/10.1016/0167-9317(91)90112-q
https://doi.org/10.1016/0167-9317(91)90112-q
Publikováno v:
Microelectronic Engineering. 13:547-550
Laser cleaning was demonstrated to be a new, promising approach to efficiently remove particulate contamination of micron and submicron size from wafer surfaces as well as from the surface and trenches of thin silicon membrane stencil masks as used f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f83b879cbda9ce31ed8afde0fde0bc16
https://doi.org/10.1016/0167-9317(91)90151-3
https://doi.org/10.1016/0167-9317(91)90151-3
Autor:
W. Smith, Klaus Meissner, S. Sonchik, S. Silverman, Harald Bohlen, U. Behringer, Werner Zapka, W. Haug, W. Ziemlich
Publikováno v:
Microelectronic Engineering. 13:357-360
Mix-and-match lithography between Electron Proximity Printing (EBP) and optical lithography was demonstrated in processing nine levels of a 1Mbit device up to first metallization. High overlay accuracy was achieved. For the first time we produced a l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc2d8f2fd00f1193c89e1ccd0657342b
https://doi.org/10.1016/0167-9317(91)90111-p
https://doi.org/10.1016/0167-9317(91)90111-p
Publikováno v:
Applied Physics Letters. 58:2217-2219
Laser cleaning with pulsed ultraviolet and infrared lasers is successfully employed to remove particulate contamination from silicon wafer surfaces and from delicate lithography membrane masks. Particulate material investigated include latex, alumina
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e73d0577fe8d2909cb0b7d4f38e73069
https://doi.org/10.1063/1.104931
https://doi.org/10.1063/1.104931
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