Zobrazeno 1 - 10
of 30
pro vyhledávání: '"W. Olesińska"'
Publikováno v:
Bulletin of the Polish Academy of Sciences: Technical Sciences. 62:23-32
The effect of phase transformations induced in the surface layer of alumina ceramics during its direct joining with copper activated with oxygen or titanium on the mechanical strength of the ceramic/copper joints was examined. The materials used in t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::94038f1330cdfed2f1e131c708ac9929
https://doi.org/10.2478/bpasts-2014-0003
https://doi.org/10.2478/bpasts-2014-0003
Autor:
K. Borkowska, D. Kaliński, W. Olesińska, Marcin Chmielewski, Marek Barlak, Zbigniew Werner, B. Sartowska, Jerzy Piekoszewski, Jacek Jagielski
Publikováno v:
Surface and Coatings Technology. 201:8317-8321
Ion implantation was utilized as a pre-treatment method for direct bonding of ceramics with copper. Aluminum nitride samples were implanted with metallic ions (Ti, Cr, Fe, Cu) and/or with oxygen. The choice of implanted species was based upon thermod
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::728829d65f678ed15db4dd2fa6a94368
https://doi.org/10.1016/j.surfcoat.2006.01.090
https://doi.org/10.1016/j.surfcoat.2006.01.090
Publikováno v:
Journal of Materials Science: Materials in Electronics. 17:781-788
The paper presents the results concerning the formation of a ‘barrier’ layer on AlN ceramic during its joining with copper by the Copper Direct Bonding (CDB) technique. The surface of the ceramic was modified with titanium, using various amounts
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac83366a56750726274b9ecbb5cfcffc
https://doi.org/10.1007/s10854-006-0024-1
https://doi.org/10.1007/s10854-006-0024-1
Autor:
Jacek Jagielski, Zbigniew Werner, Marcin Chmielewski, B. Sartowska, Jerzy Piekoszewski, W. Olesińska, Marek Barlak, D. Kaliński
Publikováno v:
Vacuum. 78:205-209
Ion implantation was examined as a pre-treatment procedure for AlN substrates used for direct bonding with Cu. It replaces the conventional process of thermal oxidation. Ti, Fe and O ions were used at acceleration voltages of 15 and 70 kV in the dose
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc1632de6f5bea303abb4368236fa31f
https://doi.org/10.1016/j.vacuum.2005.01.027
https://doi.org/10.1016/j.vacuum.2005.01.027
Publikováno v:
Journal of Materials Science: Materials in Electronics. 15:813-817
The paper presents the results of studies on the joining of non-oxide ceramics with copper with the use of intermediary metallic layers. AlN ceramics was covered with Mo, Mn, FeSi, Ti intermediary layers, Si3N4 ceramics – with Cu, Mn, Ti layers, an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5879f3b0c31550305ea50b06e8b24fa2
https://doi.org/10.1023/b:jmse.0000045305.30905.91
https://doi.org/10.1023/b:jmse.0000045305.30905.91
Autor:
W. Olesińska, M. Czuba, Marek Berkowski, Jan Fink-Finowicki, R. Aleksiyko, Slawomir Maksymilian Kaczmarek
Publikováno v:
Crystal Research and Technology. 36:865-873
Single crystals of La 1-x Sr x Ga 1-x Ti x O 3 solid solution with x = 0.01, 0.04 and 0.08 were grown by the Czochralski method and with x = 0.01 by the floating zone method. Large good quality single crystals were grown by the Czochralski method fro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4ad99d8f52aaf145a50ab10e8cf92b2f
https://doi.org/10.1002/1521-4079(200110)36:8/10<865::aid-crat865>3.0.co
https://doi.org/10.1002/1521-4079(200110)36:8/10<865::aid-crat865>3.0.co
Publikováno v:
Journal of Materials Processing Technology. 56:190-199
The experiments carried out show that multilayer bonding by using thin and very plastic material interlayer is a good solution of the problem of making alumina - st Joints with large dimensions. Using of this type interlayer allows for relaxation of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f11503c0a2a78e18efd54754855ad3ed
https://doi.org/10.1016/0924-0136(96)85102-8
https://doi.org/10.1016/0924-0136(96)85102-8
Publikováno v:
Solid State Phenomena. 41:277-284
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54302cd6827d4164e87c82ce58339fd9
https://doi.org/10.4028/www.scientific.net/ssp.41.277
https://doi.org/10.4028/www.scientific.net/ssp.41.277
The paper presents the results concerning the formation of a ‘barrier’ layer on AlN ceramic during its joining with copper by the Copper Direct Bonding (CDB) technique. Prior to the joining, the AlN surface was modified by isothermal oxidation or
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5bfa601720aa3a33e5c6776fd8a201fe
https://doi.org/10.4028/3-908158-01-x.1537
https://doi.org/10.4028/3-908158-01-x.1537
Publikováno v:
Advanced Composites Letters. 4:096369359500400
Carbon fibre reinforced copper matrix composites have been produced to provide materials with high thermal conductivity for use in semiconductors (diodes and thyristors) and electrical contacts. The problem of poor wettability of the carbon fibres by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21838b5482aec1e59416778fed79f67e
https://doi.org/10.1177/096369359500400205
https://doi.org/10.1177/096369359500400205