Zobrazeno 1 - 10
of 178
pro vyhledávání: '"W. K. C. Yung"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 1:2005-2017
Understanding the failure mechanism of a plated through hole (PTH) is essential for a complete picture of their life span, and hence for the continued electronic reliability prediction and development of high performance printed circuit boards. This
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture. 222:643-651
From August 2007, all member states of the European Union are required to enforce a new directive, 2005/32/EC, that affects any products that rely on any forms of energy as the source for operation. These products are referred to as energy-using prod
EFFECT OF Ni-DEPOSITED CARBON NANOTUBES ON MORPHOLOGY AND SHEAR STRENGTH OF LEAD-FREE SOLDER JOINTS.
Publikováno v:
Journal of Physical Studies. 2024, Vol. 28 Issue 3, p3602-1-3602-6. 6p.
Autor:
Wan, Xuanhong1 (AUTHOR), Xu, Xijun2 (AUTHOR), Li, Fangkun1 (AUTHOR), Song, Xin1 (AUTHOR), Peng, Chenxi1 (AUTHOR), Liu, Jun1 (AUTHOR) msjliu@scut.edu.cn
Publikováno v:
Small Structures. Mar2024, Vol. 5 Issue 3, p1-24. 24p.
Publikováno v:
Green Chemistry; 7/7/2024, Vol. 26 Issue 13, p7456-7477, 22p
Autor:
Putri, Suriati Eka1,2, Ahmad, Ahyar3 ahyarahmad@gmail.com, Raya, Indah3, Tjahjanto, Rachmat Triandi4, Natsir, Hasnah3, Taba, Paulina3, Karim, Harningsih5
Publikováno v:
Rasayan Journal of Chemistry. Jan-Mar2023, Vol. 16 Issue 1, p48-60. 13p.
Publikováno v:
IOP Conference Series: Earth & Environmental Science; 2024, Vol. 1325 Issue 1, p1-12, 12p
Publikováno v:
Chinese Journal of Electrical Engineering; Mar2024, Vol. 10 Issue 1, p86-100, 15p
Publikováno v:
Macromolecular Materials & Engineering. Aug2022, Vol. 307 Issue 8, p1-11. 11p.
Autor:
Soares, Davi Marcelo1 (AUTHOR) soares@ksu.edu, Mukherjee, Santanu1 (AUTHOR), Singh, Gurpreet1 (AUTHOR) gurpreet@ksu.edu
Publikováno v:
Chemistry - A European Journal. 5/20/2020, Vol. 26 Issue 29, p6320-6341. 22p.