Zobrazeno 1 - 10
of 11
pro vyhledávání: '"W. H. Brünger"'
Publikováno v:
Microelectronic Engineering. 27:323-326
The Advanced Lithography Group (ALG) a consortium of industry and university institutes in the US and Europe has the aim to produce an Ion projection lithography tool ALG-1000 for 0.18 @mm geometry and below. The base of the machine is a new ion opti
Publikováno v:
Microelectronic Engineering. 17:245-248
By applying ion projection lithography an SAW device with 0.3 μm lines and spaces has been printed on a quartz substrate. The problem of complementary masks connected with the use of open stencil masks was solved in this special situation of a linea
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 13:2561
Damage in thin (10 nm) oxide layers of metal–oxide–semiconductor varactor cells caused by exposures with ions, electrons, and x rays has been electrically characterized by constant‐current stress time‐dependent dielectric breakdown and capaci
Autor:
Gerhard Stengl, Hans Loschner, R. Fischer, W. Finkelstein, E. Hammel, E. Cekan, G. Lammer, W. Fallmann, Ivan Berry, W. H. Brünger, J. Fegerl, A. Chalupka, G. Stangl, F. Thalinger, M. Torkler, R. W. Hill, R. Nowak, Lloyd R. Harriott, F. Paschke, H. Vonach, L.‐M. Buchmann, P. Wolf, L. Malek
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 12:3533
Coulomb interactions in charged particle beams are known to blur beam profiles as the total current is increased. While this has been studied in single ion beam columns, similar studies have not been published, so far, for masked ion beam projection
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 12:3547
Ion projection lithography has been used to structure resist lines running over 0.5‐μm‐high surface steps on a wafer. Line profiles were straight and did not change at the surface step consisting of SiO2 on Si. 0.2‐μm resolution was found in
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 11:2219
Electron‐beam induced deposition of tungsten from the precursor gas W(CO)6 was investigated with the aim of determining the resolution limiting parameters. By exploring the effect of the beam energy and current, the resolution was found to correlat
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 11:2404
The edge roughness of test patterns fabricated by ion projection lithography has been investigated to indicate the optimum experimental conditions for sub‐100‐nm resolution. Direct observation in a scanning electron microscope, electron metrology
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 10:2829
An ion projection system was tested to demonstrate the long‐term stability of lithographic properties. By exposing a resist to He+ ions, the pattern from an open stencil mask was transferred by a surface imaging process into the resist. Even after
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 10:2690
Electron‐beam induced deposition (EBID) of tungsten from the precursor gas W(CO)6 was investigated with the aim of enhancing the growth rate of the process. By varying dwell and loop time over a limited range, experimental deposition rates were com
Publikováno v:
Surface and Interface Analysis. 14:401-406
Highly focused electron beams have been scanned across chemical edges of different surface structures in a scanning Auger microscope with a field emission gun. For the case of a fracture plane across a multilayer structure with 100 nm Ta and 100 nm S