Zobrazeno 1 - 10
of 12
pro vyhledávání: '"W N Putra"'
Publikováno v:
AIP Conference Proceedings.
Publikováno v:
AIP Conference Proceedings.
Publikováno v:
Microelectronics Reliability. 53:1581-1586
As deep earth oil exploration transits into deeper earth, it faces challenges in producing reliable microelectronics devices and sensors that will not degrade at high temperature, especially those related to packaging materials and assembly of the de
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 3:732-739
The through-silicon via (TSV) approach is essential for 3-D integrated circuit (3-DIC) packaging technology. TSV fabrication process, however, is still facing several challenges. One of the widely known challenges is via protrusion. Annealing a TSV w
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 299:012068
Publikováno v:
Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
Copper Through-Silicon Via (Cu TSV) is becoming a key technology for three dimensional (3D) packaging and 3D integrated circuit (IC) applications. The microstructure of the Cu TSV is important as it not only affects the electrical properties, but ma
Publikováno v:
3DIC
Three-dimensional integrated circuit (3DIC) technologies are receiving attention due to several advantages such as multi-function, low form factor and high performance microchip. Through-silicon via (TSV) approach is essential for 3DIC packaging tech
Autor:
Riko I Made, A. D. Trigg, Woon-Seong Kwon, Jun Wei, Fa Xing Che, Chee Lip Gan, A. Heryanto, S. Gao, Kin Leong Pey, X. F. Ang, W. N. Putra
Three-dimensional (3D) integrated circuit (IC) technologies are receiving increasing attention due to their capability to enhance microchip function and performance. While current efforts are focused on the 3D process development, adequate reliabilit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c6814539234e3a1875c470b24fcb255d
https://hdl.handle.net/10356/94515
https://hdl.handle.net/10356/94515
Publikováno v:
IOP Conference Series: Materials Science & Engineering; Nov2019, Vol. 622 Issue 1, p1-1, 1p