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pro vyhledávání: '"Vu Thi Hai Van"'
Autor:
Vu Thi Hai Van, 武氏海雲
101
In Vietnam, telecommunication industries face to the trend of globalization and international integration due to the competition and technology development. Furthermore, service quality is the critical role of company to sustain competitive
In Vietnam, telecommunication industries face to the trend of globalization and international integration due to the competition and technology development. Furthermore, service quality is the critical role of company to sustain competitive
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/18037409789803169992
Autor:
Pham Thi Nam, Dinh Thi Mai Thanh, Nguyen Thu Phuong, Vu Thi Hai Van, Nguyen Thi Thom, Tran Dai Lam, Trinh Hoang Trung, Vo Thi Hanh, Nguyen Thi Thu Trang
Publikováno v:
Green Processing and Synthesis, Vol 5, Iss 5, Pp 499-510 (2016)
Fluoridated hydroxyapatite (FHAp) coatings were deposited on 316L stainless steel (316LSS) substrate by the electrodeposition method. Different concentrations of F– ion were incorporated into the apatite structure by adding NaF into the electrolyte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::14ce53001cad29081fbdde57d7ae9047
https://doi.org/10.1515/gps-2016-0064
https://doi.org/10.1515/gps-2016-0064
Autor:
Didier Devilliers, Nguyen Thi Thom, Vu Thi Hai Van, Nguyen Thu Phuong, To Thi Xuan Hang, Dinh Thi Mai Thanh, Pham Thi Nam
Publikováno v:
Journal of nanoscience and nanotechnology. 18(6)
Silica/polypyrrole nanocomposites without dopant (SiO2/PPy) and with oxalate dopant (SiO2/PPyOx) were synthesized using polymerization of pyrrole in the presence of nano SiO2. Synthesized SiO2/PPy and SiO2/PPyOx were characterized by FTIR, SEM, TEM a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d0876e6caedaf3bbb5e1e7f3938a9ab2
https://pubmed.ncbi.nlm.nih.gov/29442761
https://pubmed.ncbi.nlm.nih.gov/29442761
Akademický článek
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Autor:
Nguyen Thi, Thom, Dinh Thi Mai, Thanh, Pham Thi, Nam, Nguyen Thu, Phuong, Vu Thi Hai, Van, Ngo Quang, Minh
Publikováno v:
Journal of Electronic Materials; Jun2019, Vol. 48 Issue 6, p3931-3938, 8p, 2 Black and White Photographs, 3 Charts, 8 Graphs