Zobrazeno 1 - 10
of 40
pro vyhledávání: '"Voya R. Markovich"'
Publikováno v:
International Symposium on Microelectronics. 2012:000949-000954
Rigid-flex allows designers to replace multiple substrates interconnected with connectors, wires, and ribbon cables with a single package offering improved performance, reliability, and a potential cost-effective solution. However, processing and mat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::501d92eefd76f12b38444d6b94064d27
https://doi.org/10.4071/isom-2012-wp54
https://doi.org/10.4071/isom-2012-wp54
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:001527-001546
There is a strong desire to develop advanced electronic substrates that can meet the growing demand for miniaturization, high-speed performance, and flexibility for medical devices. To accomplish this, new packaging structures need to be able to inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43de476f2a5dce371638cdeab31aaa1d
https://doi.org/10.4071/2012dpc-wa23
https://doi.org/10.4071/2012dpc-wa23
Publikováno v:
Circuit World. 37:38-45
PurposeThere has been increasing interest in the development of printable electronics to meet the growing demand for low‐cost, large‐area, miniaturized, flexible and lightweight devices. The purpose of this paper is to discuss the electronic appl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3bab3ba1084dc6e39f131fb1a499249
https://doi.org/10.1108/03056121111101278
https://doi.org/10.1108/03056121111101278
Autor:
Frank D. Egitto, Voya R. Markovich, Mark D. Poliks, Rabindra N. Das, Francesco Marconi, Timothy Antesberger
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:001949-001976
Material formulation, structuring, and modification are key to increasing the unit volume complexity and density of next generation electronic packaging products. Laser processing is finding an increasing number of applications in the fabrication of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7eaea70d101ce17e8a0879ec47195cb3
https://doi.org/10.4071/2011dpc-wp42
https://doi.org/10.4071/2011dpc-wp42
Autor:
Konstantinos I. Papathomas, Voya R. Markovich, John M. Lauffer, Mark D. Poliks, Rabindra N. Das
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:002011-002050
Passives account for a very large part of today's electronic assemblies. This is particularly true for digital products such as cellular phones, camcorders, computers and several critical defense devices. This paper presents an entire process from de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9821ce64e0fed9e1dca4379f6b274455
https://doi.org/10.4071/2011dpc-wp46
https://doi.org/10.4071/2011dpc-wp46
Autor:
John M. Lauffer, Jianzhuang Huang, Rabindra N. Das, How T. Lin, Mark D. Poliks, Voya R. Markovich
Publikováno v:
International Symposium on Microelectronics. 2011:001012-001020
This paper examines the use of different materials in the area of printing technology. A variety of printable nanomaterials for electronic packaging have been developed. This includes nano capacitors and resistors as embedded passives, nano laser mat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7b91c82ebca820bfaa9312e4068ffeb5
https://doi.org/10.4071/isom-2011-tha4-paper2
https://doi.org/10.4071/isom-2011-tha4-paper2
Publikováno v:
International Symposium on Microelectronics. 2011:000469-000475
In this paper, the use of electrically conducting adhesives (ECA) to form z-axis interconnections for next generation packaging is discussed. In particular, current efforts related to Z-axis interconnections for device level fabrication, integration,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f30115fef6f312fac81138af431363a2
https://doi.org/10.4071/isom-2011-wa1-paper4
https://doi.org/10.4071/isom-2011-wa1-paper4
Publikováno v:
Circuit World. 36:24-32
PurposeMaterial formulation, structuring and modification are key to increasing the unit volume complexity and density of next generation electronic packaging products. Laser processing is finding an increasing number of applications in the fabricati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42cda01e04815687d679a7a20922e320
https://doi.org/10.1108/03056121011041672
https://doi.org/10.1108/03056121011041672
Publikováno v:
International Symposium on Microelectronics. 2010:000622-000629
This paper examines the use of nanomaterials in the area of “green” technology. A variety of green materials for advanced organic packaging have been developed. These include capacitors and resistors as embedded passives, resin coated Cu (RCC) as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::50d275bac4499006b6d254c0c43fddb9
https://doi.org/10.4071/isom-2010-wp3-paper3
https://doi.org/10.4071/isom-2010-wp3-paper3
Publikováno v:
International Symposium on Microelectronics. 2010:000847-000854
This paper discusses thin film technology based on barium titanate (BaTiO3)-epoxy polymer nanocomposites. In particular, we highlight recent developments on high capacitance, large area, thin film passives and their integration in System in a Package
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01c34f219b60289c6c9565a51a2b79f0
https://doi.org/10.4071/isom-2010-tha3-paper4
https://doi.org/10.4071/isom-2010-tha3-paper4