Towards Reliable 10 mu m Pitch Assembly Using Cu/Ni/SnAg based Interconnects

Autor: Taneja, D., Volpertl, M., Mendizabal, L., Chaira, T., Henry, D., Hodaj, F.

Publikováno v: 2017 IEEE 19TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC)
2017 IEEE 19TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2017, 345 E 47TH ST, NEW YORK, NY 10017 USA, Unknown Region

19th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, SINGAPORE, DEC 06-09, 2017; International audience; In this paper, the interconnect for 10 mu m are evaluated. Two processes for obtaining interconnects for 10 mu m pitch are co

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::fe4a9298d9c37822124fe46413eb72db
https://hal.science/hal-01914018