Zobrazeno 1 - 10
of 108
pro vyhledávání: '"Vladimir, Cherman"'
Autor:
Georg Elsinger, Herman Oprins, Vladimir Cherman, Geert Van der Plas, Eric Beyne, Ingrid De Wolf
Publikováno v:
Fluids, Vol 9, Iss 3, p 69 (2024)
With ever increasing integration density of electronic components, the demand for cooling solutions capable of removing the heat generated by such systems grows along with it. It has been shown that a viable answer to this demand is the use of direct
Externí odkaz:
https://doaj.org/article/082e7d6f834146eb9a9b13c24dcf7e52
Autor:
Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei
Publikováno v:
2023 IEEE International Reliability Physics Symposium (IRPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fda1283b928650c0ee4b145b0fb094a1
https://doi.org/10.1109/irps48203.2023.10117701
https://doi.org/10.1109/irps48203.2023.10117701
Autor:
Vladimir Cherman, Geert Van der Plas, Bartlomiej Jan Pawlak, Eric Beyne, Luke England, Kathryn C. Rivera, Herman Oprins, Martine Baelmans, Tiwei Wei, Zhi Yang
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:415-425
In this article, we design, demonstrate, and characterize a 3-D printed package-level polymer jet impingement cooling solution on a $23\times23$ mm2 thermal test chip. The experimental hardware results for a nozzle pitch of 2 mm show that, with 1-kW
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff62625689f7a102ce4c8685599e4858
https://doi.org/10.1109/tcpmt.2020.3045113
https://doi.org/10.1109/tcpmt.2020.3045113
Publikováno v:
Fluids, Vol 4, Iss 3, p 145 (2019)
Liquid microjet impingement cooling has shown the potential to be the solution for heat removal from electronic devices such as very-large-scale integration (VLSI) chips. The post-impingement dynamics of the jet, specifically the interaction between
Externí odkaz:
https://doaj.org/article/f91d07f3a26240138b1cfbebb65b98f6
Autor:
Jaber Derakhshandeh, Douglas Charles La Tulipe, Giovanni Capuz, Vladimir Cherman, Carine Gerets, Tom Cochet, Ehsan Shafahian, Inge De Preter, Geraldine Jamieson, Tomas Webers, Eric Beyne, Gerald Beyer, Andy Miller
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a831ba88df1e8733e67b6f5989cd3ff6
https://doi.org/10.23919/icep55381.2022.9795565
https://doi.org/10.23919/icep55381.2022.9795565
Autor:
Jaber Derakhshandeh, Eric Beyne, Gerald Beyer, Giovanni Capuz, Vladimir Cherman, Inge De Preter, Carine Gerets, Ehsan Shafahian, Koen Kennes, Geraldine Jamieson, Tom Cochet, Tomas Webers, Bert Tobback, Geert Van der Plas, Douglas Charles La Tulipe, Alain Phommahaxay, Andy Miller
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4da21639abe97e29bc350a9862b24c3e
https://doi.org/10.1109/ectc51906.2022.00179
https://doi.org/10.1109/ectc51906.2022.00179
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:577-589
This article presents the design, fabrication, experimental characterization, and modeling analysis of the chip-level hotspot targeted liquid impingement jet cooling for high-power electronics. The hotspot targeted jet impingement cooling concept is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e9e5f5a408d17c0be525c2a208f51e2c
https://doi.org/10.1109/tcpmt.2019.2948522
https://doi.org/10.1109/tcpmt.2019.2948522
Autor:
Ehsan Shafahian, Carine Gerets, Eric Beyne, Masataka Maehara, Vladimir Cherman, G. Jamieson, Pieter Bex, Jaber Derakhshandeh, Inge De Preter, Julien Bertheau, Andy Miller, Fumihiro Inoue, T. Webers, Melina Lofrano, Tom Cochet, Lin Hou, Giovanni Capuz, Geert Van der Plas, Gerald Beyer, Douglas Charles La Tulipe
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this paper full integration flow for a low temperature (150°C) and high throughput die to wafer bonding method is introduced for microbumps pitches down to $10 \mu \mathrm{m}$ . The impact of Co plating chemistry, Sn thickness, annealing temperat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5cfeeb4cc427d4dab249085f66d02da8
https://doi.org/10.1109/ectc32696.2021.00183
https://doi.org/10.1109/ectc32696.2021.00183
Autor:
Eric Beyne, Vladimir Cherman, Martine Baelmans, Shoufeng Yang, Tiwei Wei, Herman Oprins, Ingrid De Wolf
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1815-1824
The chip-level bare die direct liquid impingement jet cooling is regarded as a highly efficient cooling solution for high-performance applications. Furthermore, it shows potential to be integrated inside the chip package. In previous studies, we demo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b1729f540f94f56ba15f5e97593a9e94
https://doi.org/10.1109/tcpmt.2019.2905610
https://doi.org/10.1109/tcpmt.2019.2905610
Autor:
Eric Beyne, Vladimir Cherman, Federica Lidia Teresa Maggioni, Herman Oprins, Geert Van der Plas
Publikováno v:
Handbook of 3D Integration
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4acb48c4a50067e0fee23d79f6fbd95d
https://doi.org/10.1002/9783527697052.ch18
https://doi.org/10.1002/9783527697052.ch18