Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Vivek Chidambaram Nachiappan"'
Autor:
Surya Bhattacharya, Jong Ming Chinq, Sharon Lim Pei Siang, Vivek Chidambaram Nachiappan, Wang Xiangyu, J. Jayabalan
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Active Through-Silicon Interposer (ATSI) based 2.5D/3D IC packaging is a solution to extend Moore's law beyond the limitations inherent in 2D packages. We present the implementation of an ATSI platform for providing Analog to Digital converter (ADC),
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d2b2c0e34891169f49ef5b5552c528fe
https://doi.org/10.1109/ectc.2019.00094
https://doi.org/10.1109/ectc.2019.00094
Autor:
Vivek Chidambaram Nachiappan, Clare Guanqi Huang, Chee Lip Gan, Chee Cheong Wong, Riko I Made, Chen Zhong, Eric Jian Rong Phua, Key Wen Tan, Hock Guan Ong, Wei Chuan Ong
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000207-000212
Operating in a high temperature and pressure environment is a serious challenge for microelectronics device packaging. This study evaluates the electrical and mechanical behavior of Al, Ag, Mo, Nb and W metallization on ceramic substrates aged under
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5cdd3741f49559c66d5d415d8209ba66
https://doi.org/10.4071/hiten-wa11
https://doi.org/10.4071/hiten-wa11
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
In this study, it is shown that temporary tacking (without flux and temporary tack materials) is feasible to temporary tack Cu/SnAg or SnAg sealing ring onto Cu sealing ring at the bottom wafer. The temporary tacked samples were reflowed in a formic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d9c3da790831eb9384b291cc9cce332
https://doi.org/10.1109/eptc.2016.7861438
https://doi.org/10.1109/eptc.2016.7861438
Autor:
Chen Zhong, Wahyuaji Narotyama Putra, Wong Chee Cheong, I Made Riko, Eric Phua Jian Rong, Lim Ju Dy, Lau Fu Long, Lim Jun Zhang, Gan Chee Lip, Vivek Chidambaram Nachiappan
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
As deep earth oil exploration transits into deeper earth, it faces challenges in producing reliable microelectronics devices and sensors that will not degrade under a higher temperature and pressure environment. Numerous physical issues limit the man
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07f54b1f7fb0b40bddc258a9e59635b6
https://doi.org/10.1109/eptc.2012.6507045
https://doi.org/10.1109/eptc.2012.6507045