Zobrazeno 1 - 10
of 48
pro vyhledávání: '"Vivek Bajpai"'
Publikováno v:
Scientific Reports, Vol 12, Iss 1, Pp 1-13 (2022)
Abstract EDM is the most popular unconventional machining process. The present technology of EDM consists of a pulsed or capacitive type power supply in which the pulsed type power supply is more popular and effective. The following essential compone
Externí odkaz:
https://doaj.org/article/abaa5e72861b4a1bbf246ef062a09506
Autor:
Arnab Das, Vivek Bajpai
Publikováno v:
CIRP Journal of Manufacturing Science and Technology. 41:180-195
Autor:
Ravi Shankar Rai, Vivek Bajpai
Publikováno v:
International Journal of Materials Research. 114:335-343
Varied morphologies of crystalline copper oxide nanoparticles were synthesized using one step chemical bath deposition under microwave heating of prepared growth solution at 1200 W microwave power for a very short duration of 2–8 min. The structure
Publikováno v:
CIRP Journal of Manufacturing Science and Technology. 40:155-166
Improvement of interfacial adhesion of CuO nanostructured carbon fiber reinforced polymer composites
Autor:
Vivek Bajpai, RAVI SHANKAR RAI
Publikováno v:
Polymer Composites. 44:1789-1804
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture. 237:862-872
The purpose of this paper is to evaluate the feasibility of a novel gap-controlled strategy for micro-EDM process using magnetic levitation. The tool is levitated and positioned accurately using a unique actuator arm. The actuator arm attained the re
Autor:
Mohan Kumar, Vivek Bajpai
Publikováno v:
Journal of Materials Engineering and Performance. 32:2139-2150
Autor:
Vivek Bajpai, Ankit Jain
Publikováno v:
Surface Engineering. 38:174-182
Autor:
Ravi Shankar Rai, Vivek Bajpai
Publikováno v:
Materials Today: Proceedings. 57:84-89
Publikováno v:
Advances in Forming, Machining and Automation ISBN: 9789811938658
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d46292bed59aef9916acfcca52572df
https://doi.org/10.1007/978-981-19-3866-5_23
https://doi.org/10.1007/978-981-19-3866-5_23