Development of a lead free chip scale package for wireless applications.

Autor: Kripesh, V., Poi-Siong Teo, Tai, C.T., Vishwanadam, G., Yew Cheong Mui

Publikováno v: 2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p665-670, 6p