Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Vishal Nagaraj"'
Autor:
Vishal Nagaraj, Xuejun Fan
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
In this paper, finite element modeling of anomalous moisture diffusion using commercial finite element code is developed. The modeling method and numerical implementation is based on a dual stage model with both stages described by Fickian terms math
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c87620c80c19581ea506bc5ee785ed1
https://doi.org/10.1109/ectc.2012.6248987
https://doi.org/10.1109/ectc.2012.6248987
Autor:
Vishal Nagaraj, Xuejun Fan
Publikováno v:
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Moisture desorption characteristics of an epoxy mold compound (EMC) at 100°C, 120°C, 140°C, 160°C, 180°C, 200°C, 220°C, 240°C, and 260°C, respectively, is studied in this paper. A high resolution moisture analyzer is used to measure in-situ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87b1223da7b7e9d325dec49e60d7f849
https://doi.org/10.1109/esime.2012.6191772
https://doi.org/10.1109/esime.2012.6191772
Publikováno v:
2009 59th Electronic Components and Technology Conference.
In this paper, a non-linear analysis is performed in detail to study the effect of package architectural attributes such as die thickness, die size, substrate thickness, substrate size and passivation opening (PO) size on the stress induced in the bu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e28e100f7301050e44e30af3b9cf824a
https://doi.org/10.1109/ectc.2009.5074125
https://doi.org/10.1109/ectc.2009.5074125
Publikováno v:
2008 58th Electronic Components and Technology Conference.
The advancement in flip chip technology has enabled us to meet the requirement of smaller die size along with the increased functionality. Due to this development in flip chip packaging technology along with higher current carrying requirement of sol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2d32fd7f85c7987ec1ccf45137ea251
https://doi.org/10.1109/ectc.2008.4549994
https://doi.org/10.1109/ectc.2008.4549994
Publikováno v:
Volume 11: Micro and Nano Systems, Parts A and B.
As there is continuous demand for miniaturization of electronic devices, flip chip technology is predominantly used for high density packaging. The technology offers several advantages like excellent electrical performance and better heat dissipation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cebc9c32cce790bad8f73b3fd7c7def8
https://doi.org/10.1115/imece2007-43766
https://doi.org/10.1115/imece2007-43766