Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Vinod S Chippalkatti"'
Publikováno v:
Egyptian Journal of Remote Sensing and Space Sciences, Vol 26, Iss 3, Pp 815- (2023)
Externí odkaz:
https://doaj.org/article/a14fa540a933444c9a861a7fda693e63
Publikováno v:
Egyptian Journal of Remote Sensing and Space Sciences, Vol 26, Iss 1, Pp 43-61 (2023)
Transmit Receive (TR) modules are the hardcore of the radar payload, which has day-night and all weather imaging capability in earth observation satellites having military and civil applications. The TR modules in satellite application will experienc
Externí odkaz:
https://doaj.org/article/ca6d9150fdb24d888a1cf538d573ce8e
Publikováno v:
Lecture Notes in Mechanical Engineering ISBN: 9789811974731
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1645e9931a033d50eaaf9342c276d606
https://doi.org/10.1007/978-981-19-7474-8_4
https://doi.org/10.1007/978-981-19-7474-8_4
Publikováno v:
Lecture Notes in Electrical Engineering ISBN: 9789811971976
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e57047ccbdcb08b180ce2d568a24b09
https://doi.org/10.1007/978-981-19-7198-3_1
https://doi.org/10.1007/978-981-19-7198-3_1
Publikováno v:
Lecture Notes in Mechanical Engineering ISBN: 9789811974731
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e1393a4a525889b7ffc923f21c9ae6d9
https://doi.org/10.1007/978-981-19-7474-8_22
https://doi.org/10.1007/978-981-19-7474-8_22
Publikováno v:
2022 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab3b5a31cf199ea1ce13a2e1d9f39908
https://doi.org/10.1109/mapcon56011.2022.10047527
https://doi.org/10.1109/mapcon56011.2022.10047527
Structural and thermal modeling, verification, and optimization of space TR module for radar imaging
Autor:
Vinod S. Chippalkatti, Rajashekhar C. Biradar, B. K. Chandrashekar, K. R. Suresha, Santosh Joteppa
Publikováno v:
International Journal on Interactive Design and Manufacturing (IJIDeM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::602591051b8d5e9ccca2891440981c52
https://doi.org/10.1007/s12008-022-01133-3
https://doi.org/10.1007/s12008-022-01133-3
Publikováno v:
2022 IEEE Fourth International Conference on Advances in Electronics, Computers and Communications (ICAECC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d23ec27190585d33d37e869a86644b08
https://doi.org/10.1109/icaecc54045.2022.9716628
https://doi.org/10.1109/icaecc54045.2022.9716628
Publikováno v:
2021 IEEE MTT-S International Microwave and RF Conference (IMARC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::867511e1436d260239c7025ce91b808b
https://doi.org/10.1109/imarc49196.2021.9714686
https://doi.org/10.1109/imarc49196.2021.9714686
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06491e4d36b1fc381b85dd262d4ada11
https://doi.org/10.1109/eptc53413.2021.9663973
https://doi.org/10.1109/eptc53413.2021.9663973