Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Vinh Khuu"'
Publikováno v:
ASME 2007 InterPACK Conference, Volume 1.
Thermal interface materials are used to reduce the interfacial thermal resistance between contacting surfaces inside electronic packages, such as at the die-heat sink or heat spreader-heat sink interfaces. In this study, the change in thermal perform
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0cae09560d67b0a5cb4b64d629f12fb
https://doi.org/10.1115/ipack2007-33554
https://doi.org/10.1115/ipack2007-33554
