Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Vincent Mandrillon"'
Autor:
Aurélien Suhm, Vincent Gaud, Vincent Mandrillon, Tony Maindron, Marion Provost, Katarzyna Raulin
Publikováno v:
SID Symposium Digest of Technical Papers. 49:1007-1010
Autor:
Aurelie Vandeneynde, Vincent Delaye, Bernard Aventurier, Vincent Mandrillon, Nicolas Troc, Tony Maindron
Publikováno v:
SID Symposium Digest of Technical Papers. 48:1960-1962
Autor:
Vincent Mandrillon, Guillaume Parry, Yves Bréchet, Tony Maindron, Rafael Estevez, David Mercier, Marc Verdier
Publikováno v:
Thin Solid Films
Thin Solid Films, Elsevier, 2017, 638, pp.34-47. ⟨10.1016/j.tsf.2017.07.040⟩
Thin Solid Films, 2017, 638, pp.34-47. ⟨10.1016/j.tsf.2017.07.040⟩
Thin Solid Films, Elsevier, 2017, 638, pp.34-47. ⟨10.1016/j.tsf.2017.07.040⟩
Thin Solid Films, 2017, 638, pp.34-47. ⟨10.1016/j.tsf.2017.07.040⟩
Thin amorphous alumina layers (10 to 40 nm thick) are processed on sputtered aluminum thin film (500 nm) by atomic layer deposition (ALD) at low temperature (85 °C). Global methodology combining quantitative experimental observations of fracture and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5e28c0910121e933ce0ce8b36707f887
https://hal.archives-ouvertes.fr/hal-01685489
https://hal.archives-ouvertes.fr/hal-01685489
Mechanics of cracking failure in a silver layer deposited by inkjet printing on a flexible substrate
Autor:
Guillaume Parry, Vincent Mandrillon, Marie Le Druillennec, Guillaume Audoit, Christophe Poulain, Rafael Estevez
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC).
This work intends to investigate strain fields around cracks in thin metallic film deposited on flexible substrate through an experimental approach. The studied sample consists of a pre-cracked silver nanoparticles inkjet printed layer with a thickne
Publikováno v:
Journal of Materials Science. 46:6111-6117
RF MEMS (Radio Frequency Micro Electro Mechanical System) switches are promising devices but their gold-on-gold contacts, assimilated for this study to a sphere/plane contact, represent a major reliability issue. A first step toward understanding fai
Publikováno v:
Matériaux & Techniques. 99:169-178
La nanoindentation est une technique de caracterisation bien adaptee pour determiner les proprietes mecaniques des couches minces. Cependant, pour des couches d’epaisseur de quelques centaines de nanometres, le substrat et les couches sous-jacentes
Publikováno v:
Matériaux & Techniques. 99:245-252
La duree de vie du contact des micro-commutateurs MEMS (micro electro mechanical systems) limite leur competitivite. Le materiau de contact generalement utilise, sous forme d’un film mince, est l’or. Les principales causes de defaillance sont lie
Publikováno v:
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
This paper report a new methodology combining finite element modeling (FEM) and nanoindentation tests in order to extract the plasticity law of ECD copper film. Thanks to this approach, we demonstrate that simple plasticity law (ANSYS Multilinear ISO
Autor:
Herve Boutry, Chevalier Lionel, Vincent Mandrillon, Antoine Nowodzinski, Didier Bloch, R. Franiatte, David Bouchu, Karine Rousseau
Publikováno v:
Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Failure analyses on μinsert technology used for 2.5D stacking are carried out after 1000 hours of damp heat test on nickel, copper and gold-nickel μinserts. We show that nickel μinserts are prone to delamination when the force applied on the repor
Autor:
Sophie Verrun, Remy Franiatte, Vincent Mandrillon, Antoine Nowodzinski, Romain Anciant, Herve Boutry, Gilles Simon
Publikováno v:
2012 International Semiconductor Conference Dresden-Grenoble (ISCDG).
Micro-insert technology is a wafer level stacking technology offering main advantages such as simplicity, low cost and compatibility with chip assembly technologies. This paper presents recent preliminary reliability tests results. Thermal cycling te