Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Vilmarie Soler"'
Autor:
Jorge Lubguban, John J. Garant, Robert Katz, Vilmarie Soler, Sarah H. Knickerbocker, Norman Robson, Daniel Smith, Daniel Fisher
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
This work demonstrates face-to-face hybrid wafer bonding at GLOBALFOUNDRIES, including fine pitch characterization and processing, along with preliminary reliability results. Bonding alignment data analysis is shown, as it is imperative to have high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b9bed48ca8821e3e6ef5b1b9b3fbe77
https://doi.org/10.1109/ectc32862.2020.00099
https://doi.org/10.1109/ectc32862.2020.00099
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
The microelectronics industry continues to witness an ever-increasing movement towards heterogeneous integration leveraging the advantages of 2.5D and 3D/TSV in advanced semiconductor packaging and integration. New processes and physical structures a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0bfe66cda0134e4aa726aa974bd4aa2
https://doi.org/10.1109/ectc.2014.6897509
https://doi.org/10.1109/ectc.2014.6897509