Zobrazeno 1 - 10
of 47
pro vyhledávání: '"Vijay Sukumaran"'
Autor:
Zihan Wu, Yuya Suzuki, Rao Tummala, Vijay Sukumaran, Youngwoo Kim, Joungho Kim, Srikrishna Sitaraman, Markondeya Raj Pulugurtha, Venky Sundaram
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1410-1418
This paper presents the modeling, design, fabrication, and characterization of an innovative and miniaturized thin-film bandpass filter with coupled spiral structures in ultrathin glass substrates (30– $100~\mu \text{m}$ ). This filter is demonstra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d6f510b857c611cf692d4f74d5b013e
https://doi.org/10.1109/tcpmt.2017.2708704
https://doi.org/10.1109/tcpmt.2017.2708704
Autor:
Koushik Ramachandran, Toshitake Seki, Kaya Demir, Venky Sundaram, Gokul Kumar, Yuya Suzuki, Vijay Sukumaran, Rao Tummala, Yoichiro Sato
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:786-795
A double-sided and ultrathin 3-D glass interposer with through package vias (TPVs) at same pitch as through silicon vias (TSVs) in silicon interposers is developed to provide a compelling alternative to 3-D IC stacking of logic and memory devices wit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06dd94af5b19e49af37fe2f2a6b08711
https://doi.org/10.1109/tcpmt.2014.2303427
https://doi.org/10.1109/tcpmt.2014.2303427
Autor:
Benjamin V. Fasano, Richard F. Indyk, Brittany Hedrick, Franklin M. Baez, Jorge Lubguban, Michael S. Cranmer, Shidong Li, Luc Guerin, Sarah H. Knickerbocker, David J. Lewison, Marc Phaneuf Luc Ouellet, Ian D. Melville, Koushik Ramachandran, Charles L. Arvin, Maryse Cournoyer, Daniel Berger, Christopher L. Tessler, John J. Garant, Matthew Angyal, Jean Audet, Vijay Sukumaran, Subramanian S. Iyer
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
The processes key to enabling 3D manufacturing, namely, bond, backgrind, and through silicon via (TSV) reveal, are extended for 300 mm glass substrates to fabricate a heterogeneous, multi-die, 2.5D glass interposer. Based on an existing silicon inter
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2b4aad595f4909b659aff313054dc4c
https://doi.org/10.1109/ectc.2016.261
https://doi.org/10.1109/ectc.2016.261
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:1426-1433
Interconnecting integrated circuits (ICs) and 3-D-ICs to the system board (printed circuit board) are currently achieved using organic or silicon-based interposers. Organic interposers face several challenges in packaging 2-D and 3-D-ICs beyond the 3
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c14ab152f5b612bb920e172ba2dfb356
https://doi.org/10.1109/tcpmt.2012.2204392
https://doi.org/10.1109/tcpmt.2012.2204392
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:001807-001826
Glass interposers offer a compelling alternative to silicon interposers with highest I/Os and excellent electrical performance, with potential for low cost from large panel processing. For sub-32nm IC nodes and 3D-IC packages at fine I/O pitch, organ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::31492817b2b6842dfecd2b50d7b9a741
https://doi.org/10.4071/2012dpc-wp16
https://doi.org/10.4071/2012dpc-wp16
Autor:
Venky Sundaram, Vijay Sukumaran, Jibin Sun, Gee-Kung Chang, Yoichiro Sato, Rao Tummala, Bruce C. Chou
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
This paper presents, for the first time, the 3D Glass Photonics (3DGP) technology being developed by Georgia Tech, based on ultra-thin 3D glass interposer [1]. The 3DGP system integrates both optical and electrical interconnects in the same glass sub
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d51acaf921e5c010b193c3196b0b8a0b
https://doi.org/10.1109/ectc.2013.6575585
https://doi.org/10.1109/ectc.2013.6575585
Autor:
Rao Tummala, Srikrishna Sitaraman, Junki Min, Bruce C. Chou, Christian Nopper, Motoshi Ono, Yoichiro Sato, Franck Dosseul, Madhavan Swaminathan, Venky Sundaram, Vijay Sukumaran, Choukri Karoui
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
This paper demonstrates ultra-miniaturized RF passive components integrated on thin glass substrate with small Through Package Vias (TPVs) to realize 3D Integrated Passive and Actives Component (IPAC) concept. Miniaturization is achieved through; a)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c75de71cdad08e07dcb09d2b9861e2e
https://doi.org/10.1109/ectc.2013.6575795
https://doi.org/10.1109/ectc.2013.6575795
Autor:
R.V. Pucha, Yoichiro Sato, Kaya Demir, Qiao Chen, Vijay Sukumaran, Koushik Ramachandran, Rao Tummala, Venkatesh Sundaram
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
This paper reports reliability of copper-plated through-package-vias (TPVs) in glass interposer by modeling and experimental validation using accelerated life tests. In this paper, both thermomechanical reliability and electrochemical reliability of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc6963887bb95e04a528dfc4b31ae73e
https://doi.org/10.1109/ectc.2013.6575595
https://doi.org/10.1109/ectc.2013.6575595
Autor:
Armand R. Tanguay, Venky Sundaram, Vijay Sukumaran, James D. Weiland, Michael E. Cato, Rao Tummala, Fuhan Liu, Patrick J. Nasiatka
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Retinal prostheses implemented by means of electrical stimulation of retinal ganglion cells have been previously demonstrated with 16 and 60 channel microstimulator arrays. Blind patients with severe retinal degeneration (e.g., retinitis pigmentosa (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::880844c12c82124df024ef79c347f032
https://doi.org/10.1109/ectc.2011.5898680
https://doi.org/10.1109/ectc.2011.5898680
Autor:
Vijay Sukumaran, Rao Tummala, Venky Sundaram, Tapobrata Bandyopadhyay, Sung Kyu Lim, Gokul Kumar
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Smart mobile applications are driving the demand for higher logic-to-memory bandwidth (BW) in 10–30 GB/s range with lower power consumption and larger memory capacity. This paper presents a radically-different, scalable and lower cost approach than
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce8a0e819d95f24fd940306581617e9d
https://doi.org/10.1109/ectc.2011.5898516
https://doi.org/10.1109/ectc.2011.5898516