Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Victor Gredy"'
Autor:
Bassel Ayoub, Sandrine Lhostis, Stephane Moreau, Emeline Souchier, Emilie Deloffre, Sebastien Mermoz, Maria Gabriela Gusmao Cacho, Norah Szekely, Christelle Rey, Ece Aybeke, Victor Gredy, Patrick Lamontagne, Olivier Thomas, Helene Fremont
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a42f50d1b2b2ec4d3e00f1ba77cb1dba
https://doi.org/10.1109/eptc56328.2022.10013180
https://doi.org/10.1109/eptc56328.2022.10013180
Autor:
Sebastien Soulan, Audrey Berthoud, Jean-Hervé Tortai, Victor Gredy, Maxime Templier, Delphine Le Cunff, Raffaele Bianchini, Thomas Alcaire, Mehdi Kessar
Publikováno v:
Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV
SPIE Advanced Lithography
SPIE Advanced Lithography, Feb 2021, Online Only, France. pp.79, ⟨10.1117/12.2582058⟩
SPIE Advanced Lithography
SPIE Advanced Lithography, Feb 2021, Online Only, France. pp.79, ⟨10.1117/12.2582058⟩
International audience; On imager devices, color resists are used as optical filters to produce RGB pixel arrays. These layers are depositedthrough spin coating process towards the end of the fabrication process flow, where complex topography can ind
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0c354d828719386199ae82490427b37d
https://hal-cnrs.archives-ouvertes.fr/hal-03368015
https://hal-cnrs.archives-ouvertes.fr/hal-03368015
Publikováno v:
2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), Aug 2020, Saratoga Springs, United States. pp.1-6, ⟨10.1109/ASMC49169.2020.9185349⟩
2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), Aug 2020, Saratoga Springs, United States. pp.1-6, ⟨10.1109/ASMC49169.2020.9185349⟩
International audience; Spectroscopic ellipsometry is a very sensitive metrology technique to accurately measure the thickness and the refractive index of the different layers present on specific dedicated metrology targets. In parallel, optical defe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c66082936e37232f5fc12bdad4f50f3c
https://hal-cnrs.archives-ouvertes.fr/hal-03017738
https://hal-cnrs.archives-ouvertes.fr/hal-03017738
Autor:
Victor Gredy, D. Guiheux, V. Brouzet, K. Le-Chao, F. Chenevas-Paule, Delphine Le-Cunff, A. Laurent, V. Coutellier
Publikováno v:
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
With the introduction of new materials in Back-End of Lines to overcome the development of new options in mature technologies, controlling the local stress and establishing its potential impact on yield becomes more and more critical. In the same way
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::927ef6191b2fdc1e7dcf0a2cf84b2d92
https://doi.org/10.1109/asmc.2019.8791784
https://doi.org/10.1109/asmc.2019.8791784
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXIII
Metrology, Inspection, and Process Control for Microlithography XXXIII, Feb 2019, San Jose, France. pp.97, ⟨10.1117/12.2512398⟩
Metrology, Inspection, and Process Control for Microlithography XXXIII, Feb 2019, San Jose, France. pp.97, ⟨10.1117/12.2512398⟩
Every nanometer of residual nano-topography (with high spatial frequency fingerprint) that the scanner cannot correct during the wafer exposure directly propagates into the focus budget [1]. Process windows are getting tight with a greater and greate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8eb4308a84e5367184a666292d5cdbfd
https://hal.archives-ouvertes.fr/hal-03331721
https://hal.archives-ouvertes.fr/hal-03331721