Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Vicky Hasse"'
Autor:
Federico Balduini, Alan Molinari, Lorenzo Rocchino, Vicky Hasse, Claudia Felser, Marilyne Sousa, Cezar Zota, Heinz Schmid, Adolfo G. Grushin, Bernd Gotsmann
Publikováno v:
Nature Communications, Vol 15, Iss 1, Pp 1-7 (2024)
Abstract The chiral anomaly - a hallmark of chiral spin-1/2 Weyl fermions - is an imbalance between left- and right-moving particles that underpins phenomena such as particle decay and negative longitudinal magnetoresistance in Weyl semimetals. The d
Externí odkaz:
https://doaj.org/article/05dbb72856724526988bd8b86324bcec
Autor:
Maria Victoria Ale Crivillero, Jean C. Souza, Vicky Hasse, Marcus Schmidt, Natalya Shitsevalova, Slavomir Gabáni, Konrad Siemensmeyer, Karol Flachbart, Steffen Wirth
Publikováno v:
Condensed Matter, Vol 8, Iss 1, p 9 (2023)
Scanning Tunneling Microscopy and Spectroscopy (STM/S), with its exceptional surface sensitivity and exquisite energy resolution, is well suited for the investigation of surface states down to atomic length scales. As such, it became an essential too
Externí odkaz:
https://doaj.org/article/ca2a3b6f74cb40a588822750efa78aff
Autor:
Hyeuk Jin Han, Sushant Kumar, Gangtae Jin, Xiaoyang Ji, James L. Hart, David J. Hynek, Quynh P. Sam, Vicky Hasse, Claudia Felser, David G. Cahill, Ravishankar Sundararaman, Judy J. Cha
The increasing resistance of Cu interconnects for decreasing dimensions is a major challenge in continued downscaling of integrated circuits beyond the 7-nm technology node as it leads to unacceptable signal delays and power consumption in computing.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::17c0d7b55c56b5d55df73ae07a09327f
Autor:
Gangtae Jin, Hyeuk Jin Han, James L. Hart, Quynh P. Sam, Mehrdad T. Kiani, David J. Hynek, Vicky Hasse, Claudia Felser, Judy J. Cha
Publikováno v:
Applied Physics Letters. 121:113105
Topological semimetals (TSMs) possess topologically protected surface states near the Fermi level with high carrier densities and high mobilities, holding distinct potential for low-dissipation on-chip interconnects that may outperform current copper