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pro vyhledávání: '"Vespel"'
Akademický článek
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Publikováno v:
Scientific Reports, Vol 9, Iss 1, Pp 1-4 (2019)
Scientific Reports
Scientific Reports
We report measurements of the thermal conductance of a structure made from commercial Acrylonitrile Butadiene Styrene (ABS) modules, known as LEGO® blocks, in the temperature range from 70 mK to 1.8 K. A power law for the sample’s thermal conducti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bc81771e6f07b2d0de37cc9438007d5c
http://link.springer.com/article/10.1038/s41598-019-55616-7
http://link.springer.com/article/10.1038/s41598-019-55616-7
Autor:
Hardeep S. Mehta, Mathew Campos, Nancy M. Washton, David W. Hoyt, Jesse A. Sears, Ying Chen, David J. Heldebrant, Eric D. Walter, Karl T. Mueller, Jotheeswari Kothandaraman
Publikováno v:
Solid State Nuclear Magnetic Resonance. 102:31-35
We present a novel nuclear magnetic resonance (NMR) probe design focused on optimizing the temperature gradient across the sample for high temperature magic angle spinning (MAS) experiments using standard rotors. Computational flow dynamics (CFD) sim
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a416b136aba72ad0f553a72a50b38080
https://doi.org/10.1016/j.ssnmr.2019.06.003
https://doi.org/10.1016/j.ssnmr.2019.06.003
Autor:
Gwyn A. Lord
Publikováno v:
Rapid Communications in Mass Spectrometry. 34
Quantitation of analytes by liquid chromatography/mass spectrometry (LC/MS) is now very widely used, usually with an appropriate internal standard, but this does not guarantee problem-free analyses. Investigation of a problem that arose during method
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bc05b409f9ba50362c6f98ecbb155551
https://doi.org/10.1002/rcm.8672
https://doi.org/10.1002/rcm.8672
Publikováno v:
DEMM: Engineering & Manufacturing. May2013, p26-26. 1/2p.
Publikováno v:
Fusion Science and Technology. 71:507-513
In an ideal tritium system, we would be able to remove all polymer components due the damage incurred by the resulting beta decay and reduce the required maintenance of the systems and its ...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::028b09f37dbf97253910a230652db5b7
https://doi.org/10.1080/15361055.2017.1293448
https://doi.org/10.1080/15361055.2017.1293448
Publikováno v:
Cryogenics. 114:103236
The purpose of this study was to investigate a parameterized mathematical approach for estimating the complex modulus of a polyimide film at extreme cryogenic temperatures (e.g. 4 K). Such films are used in extreme cryogenic applications such as supe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::946fad9dde21b58fb378acf6506370cc
https://doi.org/10.1016/j.cryogenics.2020.103236
https://doi.org/10.1016/j.cryogenics.2020.103236
We present measurements of the low temperature thermal conductivity for materials useful in the construction of cryogenic supports for scientific instrumentation and in the fabrication of flat flexible cryogenic cabling. The materials we measure have
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fb5db7fdf61964bcaf680ceb50f2f922
http://arxiv.org/abs/1810.10187
http://arxiv.org/abs/1810.10187
Autor:
Wai Shan Liau, Tek Keong Gan
Publikováno v:
2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT).
The common problem vespel collet; the eutectic die bonding process pick up tool; is a short lifespan. The collet tip dimension is similar to shrink chip (size
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad55273b1b140e523ec76b868b9e271f
https://doi.org/10.1109/iemt.2018.8511724
https://doi.org/10.1109/iemt.2018.8511724
The dielectric properties of selected conductively-loaded polyimide samples are characterized in microwave through far infrared wavebands. These materials, belonging to the Vespel\textsuperscript{\textregistered} family, are more readily formed by di
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a163f30c2e0ec0b0353302ada8bf2f59