Výsledky vyhledávání - "Vertyanov, D. V."

Akademický článek

Physical and Technological Characteristic Features of the Process of Installation of Dies onto a Temporary Foundation in Internal Wiring Technology.

Autor: Vertyanov, D. V.¹ (AUTHOR), Korobova, N. E.¹ (AUTHOR) korobova0210@gmail.com, Pogudkin, A. V.¹ (AUTHOR), Kravtsova, V. D.² (AUTHOR)

Publikováno v: Technical Physics. Oct2020, Vol. 65 Issue 10, p1677-1684. 8p.

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Akademický článek

Modeling of Heat Transfer for a Three-Dimensional Microelectromechanical Mirror Element with Consideration of Its Packaging Features.

Autor: Evstafyev, S. S., Samoylikov, V. K., Vertyanov, D. V.

Publikováno v: Russian Microelectronics; 2023 Suppl 1, Vol. 52, pS129-S133, 5p

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Akademický článek

Research and Analysis of Thermomechanical Stresses in the Structure of a Wafer with Embedded ICs with Consideration of Temperature Effects in Manufacturing Process Route.

Autor: Evstafyev, S. S., Solovyov, I. A., Kochergin, M. D., Vertyanov, D. V.

Publikováno v: Russian Microelectronics; 2023 Suppl 1, Vol. 52, pS251-S256, 6p

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Akademický článek

Study of the Influence of Mechanical and Temperature Effects on the Level of Stresses and Deformations in 3D Microassemblies Hermetically Sealed with Two Types of Compounds.

Autor: Vertyanov, D. V., Belyakov, I. A., Pogudkin, A. V., Timoshenkov, S. P., Sidorenko, V. N.

Publikováno v: Russian Microelectronics; Dec2022, Vol. 51 Issue 7, p531-538, 8p

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Akademický článek

Copper-Containing Compositions Based on Alicyclic Polyimide for Microelectronic Applications.

Autor: Kravtsova, V. D., Umerzakova, M. B., Korobova, N. E., Vertyanov, D. V.

Publikováno v: Russian Microelectronics; Nov2018, Vol. 47 Issue 7, p455-459, 5p

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Conference

Peculiarities of multichip micro module frameless design with ball contacts on the flexible board.

Autor: Vertyanov, D. V., Tikhonov, K. S., Timoshenkov, S. P., Petrov, V. S., Blinov, G. A.

Publikováno v: 2013 IEEE XXXIII International Scientific Conference Electronics & Nanotechnology (ELNANO); 2013, p417-419, 3p

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