Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Veronique Rochus"'
Autor:
Bogdan C. Raducanu, Refet F. Yazicioglu, Carolina M. Lopez, Marco Ballini, Jan Putzeys, Shiwei Wang, Alexandru Andrei, Veronique Rochus, Marleen Welkenhuysen, Nick van Helleputte, Silke Musa, Robert Puers, Fabian Kloosterman, Chris van Hoof, Richárd Fiáth, István Ulbert, Srinjoy Mitra
Publikováno v:
Sensors, Vol 17, Iss 10, p 2388 (2017)
We present a high electrode density and high channel count CMOS (complementary metal-oxide-semiconductor) active neural probe containing 1344 neuron sized recording pixels (20 µm × 20 µm) and 12 reference pixels (20 µm × 80 µm), densely packed
Externí odkaz:
https://doaj.org/article/1a505eb9b3c84a97bea679e1b5d7b098
Autor:
Hilde Jans, Cedric Pieters, Deep Bera, Grim Keulemans, Roelof Jansen, Veronique Rochus, Jon Kjellman, Hasan M. Mahmud-Ul-Hasan, Xavier Rottenberg
Publikováno v:
Medical Imaging 2023: Biomedical Applications in Molecular, Structural, and Functional Imaging.
Publikováno v:
The Journal of the Acoustical Society of America. 151(6)
Acoustic tweezers are increasingly utilized for the contactless manipulation of small particles. This paper provides a theoretical model demonstrating the acoustic manipulation capabilities of single-beam acoustic transducers. Analytical formulas are
Autor:
Bogdan Vysotskyi, Veronique Rochus
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Autor:
Margo Billen, Pieter Gijsenbergh, Eloi M. Ferrer, Mohan S. Pandian, Xavier Rottenberg, Veronique Rochus
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Publikováno v:
2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS).
Publikováno v:
Micromachines, Vol 14, Iss 7, p 1355 (2023)
As smart structures are becoming increasingly ubiquitous in our daily life, the need for efficient modeling electromechanical coupling devices is also rapidly advancing. Smart structures are often made of piezoelectric materials such as lead zirconat
Externí odkaz:
https://doaj.org/article/0b1648da6bf94342b33fceae47524b9f
Autor:
Pieter Gijsenbergh, Alexandre Halbach, Yongbin Jeong, Guilherme Brondani Torri, Margo Billen, Libertario Demi, Chih-Hsien Huang, David Cheyns, Xavier Rottenberg, Veronique Rochus
Publikováno v:
Journal of Micromechanics & Microengineering; Jul2019, Vol. 29 Issue 7, p1-1, 1p