Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Vern Stygar"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000729-000750
Glass for use as an Interposers with through vias (TGV) are emerging as the next generation substrates for die level and wafer level packaging substrates. This need is being driven increasing number of interconnects, desire to have a KGD (known good
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f6c68419d92eed21bae7a8c33af1af1
https://doi.org/10.4071/2013dpc-tp16
https://doi.org/10.4071/2013dpc-tp16
Autor:
Vern Stygar, Tim Mobley
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:001895-001919
This presentation will discuss TGV market trends and a low cost solution using new glass and synthetic fused quartz materials, TCE matched Cu metalizations, and designs for high density interconnect. The glass substrate or wafer combined with the low
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::70c8eb1cc769e2181220ec513fd5cdce
https://doi.org/10.4071/2012dpc-wp25
https://doi.org/10.4071/2012dpc-wp25
Publikováno v:
Microelectronics Reliability. 44:287-294
Low temperature co-fired ceramic (LTCC) with gold conductors has been used for high reliability applications, such as satellite communications. When the gold metallization is co-fired with the LTCC tape, inorganic adhesion additives in the gold condu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91aaa071a50319ab4e248ca037162742
https://doi.org/10.1016/s0026-2714(03)00195-1
https://doi.org/10.1016/s0026-2714(03)00195-1
Publikováno v:
Morphotropic Phase Boundary Perovskites, High Strain Piezoelectrics, and Dielectric Ceramics
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c45a093e04f7711125af40c0f21d809a
https://doi.org/10.1002/9781118380802.ch25
https://doi.org/10.1002/9781118380802.ch25
Publikováno v:
2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2.
Low Temperature Co-fired Ceramic (LTCC) materials are widely used in ceramic packaging and interconnect applications, such as RF receiving modules for next generation handsets and T/R modules for satellite communications. The application frequency sp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f737868ed6ef2c596e21fb820f86a6a1
https://doi.org/10.1115/ipack2003-35134
https://doi.org/10.1115/ipack2003-35134