Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Vera Peldzinski"'
Publikováno v:
Journal of Crystal Growth. 478:220-228
Copper films for printed circuit board applications have to be fine-grained to achieve even filling of vias. Electroplated Cu films on roll annealed Cu substrates may have unacceptably large epitaxial crystals. Here galvanic films were plated on orie
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2315b9ff3cff7329a6927a2a124a1e54
https://doi.org/10.1016/j.jcrysgro.2017.09.009
https://doi.org/10.1016/j.jcrysgro.2017.09.009
Publikováno v:
Electrochimica Acta. 196:479-486
The time evolution of galvanically plated copper films designed for semi additive processing (SAP) was investigated. Blanket copper films were plated at three current densities. Stress was monitored with the substrate curvature method during and afte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2c83c82c00fab1933475398a57b4c40
https://doi.org/10.1016/j.electacta.2016.02.167
https://doi.org/10.1016/j.electacta.2016.02.167