Copper Nanoparticle Loaded Electrospun Patches for Infected Wound Treatment: From Development to In-Vivo Application.

Autor: Butsyk, Anna¹ (AUTHOR) a.butsyk@med.sumdu.edu.ua, Varava, Yulia² (AUTHOR) yuliia.varava@gmail.com, Moskalenko, Roman¹ (AUTHOR) a.piddubny@med.sumdu.edu.ua, Husak, Yevheniia³ (AUTHOR) yevheniia.husak@polsl.pl, Piddubnyi, Artem¹ (AUTHOR), Denysenko, Anastasiia² (AUTHOR) a.denysenko@med.sumdu.edu.ua, Korniienko, Valeriia² (AUTHOR) kornienvaleria18@gmail.com, Ramanaviciute, Agne⁴ (AUTHOR) agne.ramanaviciute@gmail.com, Banasiuk, Rafal⁵ (AUTHOR) banasiuk@gmail.com, Pogorielov, Maksym^2,6 (AUTHOR) maksym.pogorielov@lu.lv, Ramanavicius, Arunas⁴ (AUTHOR) arunas.ramanavicius@chf.vu.lt, Korniienko, Viktoriia^2,6 (AUTHOR) arunas.ramanavicius@chf.vu.lt

Publikováno v: Polymers (20734360). Oct2024, Vol. 16 Issue 19, p2733. 18p.