Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Vanlai Pham"'
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Electronic devices suffer from many different types of shock environments. Especially during transportation, hugely large impacts and amplified shock accelerations are transmitted to electronic devices and container, resulting in mechanical failure o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd4479973975e8f69e82a9e538000074
https://doi.org/10.1109/itherm45881.2020.9190277
https://doi.org/10.1109/itherm45881.2020.9190277
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Reliability of solder joint is one of the most concerns in the electronic packages. The trend of smart electronic devices decreases in size and thickness and demands more and more functionality which has required electronic packages to achieve the hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43f52ead0474e5c18cd7f4f93b8912e8
https://doi.org/10.1109/ectc32862.2020.00351
https://doi.org/10.1109/ectc32862.2020.00351
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In this study, an energy-based three-dimensional (3D) model is created using Surface Evolver to predict the passive components solder joint shape after reflow soldering. The developed model considers the surface tension and hydrostatic forces on the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82530c8b92df957ccb3d0a2d9f69df8a
https://doi.org/10.1109/ectc32862.2020.00204
https://doi.org/10.1109/ectc32862.2020.00204
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In this paper, we focus on the Electromigration (EM) with three different types of solder systems, homogeneous SAC305, homogeneous SnBi58 and SAC305-SnBi58 Partial mixed. The acceleration EM test was conducted with the sample top temperature at 100C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c77df3218f261260786f431dd9852448
https://doi.org/10.1109/ectc32862.2020.00054
https://doi.org/10.1109/ectc32862.2020.00054
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:678-688
This paper presents an accurate experimental method to determine the effective strain for the advanced electronic packages with heterogeneous structure or multiple composite layers when the out-of-plane deformation has evident effects on the in-plane
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d1a1ee8eaad8ecd5d2b6c178c2b574d
https://doi.org/10.1109/tcpmt.2018.2794505
https://doi.org/10.1109/tcpmt.2018.2794505
Autor:
Vanlai Pham, Seungbae Park, Jiefeng Xu, Ke Pan, Huayan Wang, Gamal Refai-Ahmed, Jing Wang, Hohyung Lee
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
The conversion from using tin-lead solder joint to lead-free solder joint has raised many pad cratering failures for electronics manufacturing. This phenomenon has become more severe to the 2.5D package which has a large heatsink attached on the top.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6959f4332a1530984380d6aa90fbdd49
https://doi.org/10.1109/ectc.2019.00323
https://doi.org/10.1109/ectc.2019.00323
Autor:
Gamal Refai-Ahmed, Vanlai Pham, Jiefeng Xu, Seungbae Park, Scott McCann, Jing Wang, Huayan Wang, Stephen R. Cain
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
In this study, an accelerated Electromigration (EM) test was performed. The test vehicle has four types of common interconnect structure. The first one is a classic Ball Grid Array (BGA), short for BGA; the second one is a solder ball with a copper v
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d76a464e458449c358b55b2f55293e2
https://doi.org/10.1109/ectc.2019.00-25
https://doi.org/10.1109/ectc.2019.00-25
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
In this work, a study of different substrate models on package warpage is performed. Three different substrate models are built: First, the package substrate is simplified and modeled as one effective layer. Second, a three-layer model is proposed wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::017cd60dc986670dc381d8391083f999
https://doi.org/10.1109/ectc.2019.00175
https://doi.org/10.1109/ectc.2019.00175
Autor:
Scott McCann, Gamal Refai-Ahmed, Huayan Wang, Seungbae Park, Stephen R. Cain, Vanlai Pham, Jiefeng Xu
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
In this study, an Electromigration (EM) acceleration test was conducted at 150 oC ambient temperature with 12A current. The solder joint was made of SAC305. Time 0 void evolution was observed by X-ray. A Finite Element Analysis (FEA) based on Atom Fl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ee32daf3f8f1f47d7a858712ac5c9432
https://doi.org/10.1109/ectc.2019.00321
https://doi.org/10.1109/ectc.2019.00321
Publikováno v:
Microelectronics Reliability. 112:113791
Moisture induced failure is one of the major reliability concerns in electronic packaging. This research provides a comprehensive solution for modeling the moisture induced delamination in electronic packaging during solder reflow. Existing finite el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::511dfcf3964b3e0c387f466f3e79bbf0
https://doi.org/10.1016/j.microrel.2020.113791
https://doi.org/10.1016/j.microrel.2020.113791