Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Van Thanh Truong"'
Publikováno v:
Business Management / Biznes Upravlenie; 2023, Issue 4, p5-26, 22p
Autor:
Nguyen Van Thanh Truong
Publikováno v:
Journal of Science and Technology - IUH. 37
The study aimed to determine factors affect to employer’s attitude of graduating from college with a degree in business administration, and support to education organisations build the learning outcomes approach to the requirement of the employer.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba14f1cb6576849dfd82ccf9aaba7e9f
https://doi.org/10.46242/jst-iuh.v37i01.300
https://doi.org/10.46242/jst-iuh.v37i01.300
Publikováno v:
Journal of Business & Retail Management Research. 14
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4ff9ea51fd12927afc5096e3270fede
https://doi.org/10.24052/jbrmr/v14is02/art-03
https://doi.org/10.24052/jbrmr/v14is02/art-03
Publikováno v:
Journal of Marketing Thought. :64-71
This research takes a closer look at the distribution structure and systems of ZARA, assess the strengths and weaknesses of its distribution channels, and propose countermeasures to overcome such weaknesses. ZARA successfully expanded its stores arou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cfc8a5d838add7181397f51e446fcaa0
https://doi.org/10.15577/jmt.2015.01.04.64
https://doi.org/10.15577/jmt.2015.01.04.64
Autor:
Bing Dang, P.S. Andry, J. Griffith, Mario J. Interrante, Luc Guerin, Cornelia K. Tsang, Edmund J. Sprogis, Daniel Berger, John U. Knickerbocker, Steven L. Wright, Van Thanh Truong, R. Liptak, Michael J. Shapiro
Publikováno v:
IEEE Electron Device Letters. 31:1461-1463
In this letter, the integration of CMOS-compatible thru-Si via (TSV) interconnects with deep-trench decoupling capacitors is demonstrated. Reliability test is performed with a 65-nm CMOS test chip on top of a 3-D Si interposer chip that contains 10 0
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dca71e4a855ee6988291fc02b96215da
https://doi.org/10.1109/led.2010.2084068
https://doi.org/10.1109/led.2010.2084068
Autor:
R. Liptak, Cornelia K. Tsang, Michael J. Shapiro, Mario J. Interrante, Luc Guerin, J. Griffith, Van Thanh Truong, Daniel Berger, P.S. Andry, John U. Knickerbocker, Edmund J. Sprogis, B. Dang
Publikováno v:
2009 IEEE International Interconnect Technology Conference.
The use of through silicon vias (TSVs) is required to implement 3D chip stacking technology. This work explores a method to fabricate highly reliable TSVs that is compatible with CMOS processing. The key feature of the TSVs is a redundant tungsten ba
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91f8836a79533ec1bf1a2c72ad021d8f
https://doi.org/10.1109/iitc.2009.5090341
https://doi.org/10.1109/iitc.2009.5090341