Resist Strip and Cu Diffusion Barrier Etch in Cu BEOL Integration Schemes in a Mattson Highlands^TM Chamber

Autor: Mannaert, G., Van Cauwenberghe, Marc, Schmidt, M., Van Aelst, Jan, Hendrickx, D., Stucchi, M., Conard, Thierry, Vanhaelemeersch, Serge, Boullart, Werner

Publikováno v: Diffusion and Defect Data Part B: Solid State Phenomena; May 2003, Vol. 92 Issue: 1 p267-270, 4p