Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Valerie Oberson"'
Autor:
Valerie Oberson, Wolfgang Sauter, Harry D. Cox, Eric D. Perfecto, Charles L. Arvin, Nathalie Normand, Jurg Stahl
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:001553-001602
Traditional flip chip processes have consolidated to a SnAgCu (SAC) solder system. Each company based upon their own needs and application space has come to their own method to achieve the desired final composition of the interconnect. These have inc
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), May 2016, Las Vegas, France. IEEE, 2016, ⟨10.1109/ECTC.2016.29⟩
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), May 2016, Las Vegas, France. IEEE, 2016, ⟨10.1109/ECTC.2016.29⟩
Gallium liquid metal joints are described as an alternative to higher melting point tin-or lead-based solder joints in flip chip packages. A complete assembly process is described, including the bumping process with the electrodeposition of gallium o
Autor:
Xike Zhao, Charles Bureau, Maud Samson, Clement J. Fortin, David Wright, Valerie Oberson, Isabelle Paquin, Jean-Claude Raymond, Michael Barnes
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
There is an ever growing need for a fluxless chipjoin process to alleviate the difficulties associated with fluxcleaning in small gaps and to target fluxless packagingapplications such as required for advanced photonics. Moreover, a fluxless process
Autor:
David Danovitch, G. P. Brouillete, M. R. Turgeon, Valerie Oberson, Peter A. Gruber, Jean-Luc Landreville, D. T. Naugle, Luc Belanger, Da-Yuan Shih, Christopher L. Tessler
Publikováno v:
IBM Journal of Research and Development. 49:621-639
As the demand for flip-chip interconnects mounts across an increasingly large spectrum of products and technologies, several wafer-bumping proeesses have been developed to produce the small solder features required for this interconnect technology. T
Publikováno v:
2009 59th Electronic Components and Technology Conference.
The Flip Chip Plastic Ball Grid Array (FCPBGA) has become the prevalent packaging solution for mainstream microprocessors and high performance Asics. Increases in device size for these applications have begun to push the limits in terms of bond and a
Publikováno v:
2008 58th Electronic Components and Technology Conference.
Detailed observations of the impact of various process parameters on the fracture of brittle structures in low-k dielectric flip chips assembled on organic laminates using lead-free metallurgies are reported. Specifically, a simple model is first pre
Autor:
Hai P. Longworth, Harry D. Cox, D. Hawken, John J. Garant, Valerie Oberson, J. Shah, Kamalesh K. Srivastava, Eric D. Perfecto
Publikováno v:
2008 58th Electronic Components and Technology Conference.
As a part of IBM movement from Pb-rich solders to Pb-free solder, a new low cost process has been developed to deposit the solder to a capture, or under bump metal (UBM) pad, with Suss MicroTech Inc as the equipment partner. The controlled collapsed
Autor:
Valerie Oberson, Marie-Claude Paquet, Eric Duchesne, Marco Gauvin, Stephane Barbeau, Julien Sylvestre, Sylvain Ouimet, H. Lavoie
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
The migration to lead free connections in the microelectronic industry has brought forth many technical challenges, especially in the packaging technology area with respect to materials and processes. The two major drivers to these challenges are the
Autor:
Valerie Oberson, Da-Yuan Shih, M. R. Turgeon, H. Kimura, Guy Paul Brouillette, David Danovitch, Luc Belanger, Peter A. Gruber
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
A new wafer bumping technology is described that is especially suited for Pb-free applications. Although capable of using standard PbSn eutectic solder, IMS (injection molded solder) has been found to be especially suited for accommodating a wide ran