Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Vahideh Radmard"'
Autor:
Cong Hiep Hoang, Arad Azizi, Najmeh Fallahtafti, Srikanth Rangarajan, Vahideh Radmard, Charles Arvin, Kamal Sikka, Scott Schiffres, Bahgat Sammakia
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1091-1099
Autor:
Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Removal of heat is becoming a major challenge in today’s data centers. Computing-intensive applications such as artificial intelligence and machine learning are pushing data center to compute intensive systems, such as GPU, CPU, and switches to the
Autor:
Alfonso Ortega, Carol Caceres, Umut Uras, Deogratius Kisitu, Uschas Chowdhury, Vahideh Radmard, Ali Heydari
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Cold plates are at the heart of pumped liquid cooling systems. In this paper, we report on combined experimental, analytical, and computational efforts to characterize and model the thermal performance of advanced cold plates in order to establish th
Autor:
Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
The rising demand for high-performance central and graphical processing units has resulted in the need for more efficient thermal management techniques like direct-to-chip liquid cooling. Direct Liquid Cooling using cold plates is one of the most eff
Autor:
Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Akiilessh Sivakumar, Akshay Lakshminarayana, Harold Miyamura, Gautam Gupta, Dereje Agonafer, Jeremy Rodriguez
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Increasing demands for cloud-based computing and storage, Internet-of-Things, and machine learning-based applications have necessitated the utilization of more efficient cooling technologies. Direct-to-chip liquid cooling using cold plates has proven
Autor:
Ali Heydari, Vahideh Radmard, Bahareh Eslami, Mohammad I. Tradat, Yaman Manaserh, Harold Miyamura, Uschas Chowdhury, Pardeep Shahi, Kevin Dave Hall, Bahgat Sammakia, Jeremy Rodriguez
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Growing demand for dense and high-performing IT compute capacity to support deep learning and artificial intelligence workloads necessitates data centers to look for more robust thermal management strategies. Today, data centers across the world are
Autor:
Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
Publikováno v:
Journal of Electronic Packaging. 145
More than ever before, data centers must deploy robust thermal solutions to adequately host the high-density and high-performance computing that is in high demand. The newer generation of central processing units (CPUs) and graphics processing units
Autor:
Ghazal Mohsenian, Cong Hiep Hoang, Kourosh Nemati, Hussam Alissa, Mohammad Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, Bahgat Sammakia
Publikováno v:
Journal of Electronic Packaging. 144
The practice of commissioning data centers (DCs) is necessary to confirm the compliance of the cooling system to the information technology equipment (ITE) load (design capacity). In a typical DC, there are different types of ITE, each having its phy
Autor:
Bahgat Sammakia, Cong Hiep Hoang, Najmeh Fallahtafti, Vahideh Radmard, Leila Choobineh, Yaser Hadad, Paul R. Chiarot
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1304-1319
Optimization of liquid-cooled heatsinks (cold plates) is of critical importance due to their widespread application in high-performance electronic packages consisting of heterogeneous integrated systems, field programmable gate arrays (FPGAs), and on
Autor:
Najmeh Fallahtafti, Srikanth Rangarajan, Yaser Hadad, Charles Arvin, Kamal Sikka, Cong Hiep Hoang, Ghazal Mohsenian, Vahideh Radmard, Scott Schiffres, Bahgat Sammakia
Publikováno v:
International Journal of Heat and Mass Transfer. 192:122897