Zobrazeno 1 - 10
of 15
pro vyhledávání: '"V. Stolkarts"'
Autor:
Peter Micah Sandvik, Greg Dunne, James Jay McMahon, Ronald J. Olson, Zachary Stum, R. Beaupre, R. Saia, V. Stolkarts, Alexander Viktorovich Bolotnikov, Yang Sui, D. Esler, A. Gowda, A. Johnson, Liangchun Yu, Michael Hartig, Stacey Kennerly, David Alan Lilienfeld, James W. Kretchmer, Peter Almern Losee, S. D. Arthur, Ljubisa Dragoljub Stevanovic, X. Zhu
Publikováno v:
2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD).
In this paper, we report on 1.2kV SiC MOSFETs rated to T j, max =200°C, exhibiting improved performance characteristics across operating temperature. Our devices show stable, rugged and reliable operation when subjected to industry standard qualific
Publikováno v:
Journal of Electronic Packaging. 123:351-355
The proposed model describes constitutive behavior of 63Sn-37Pb solder including effects of size, thermomechanical loading, and cyclic damage. Its application to the uniaxial fatigue data shows a good agreement with the experiments.
Publikováno v:
Journal of the Mechanics and Physics of Solids. 47:2451-2468
In many materials, including tin–lead eutectic solder, a substantial portion of their fatigue life is spent in accumulation of randomly distributed microcracks. An assembly of discrete interconnected elements (e.g. grains or phases) approximates th
Publikováno v:
Materials Science and Engineering: A. 272:5-9
Experimental evidence is presented that very early in the fatigue lifetime of Sn–Pb eutectic solder the fatigue damage is governed by microcrack nucleation. A model for thermally assisted fatigue crack initiation is presented using standard equatio
Autor:
V. Stolkarts, N. Samaan
Publikováno v:
Annual Reliability and Maintainability Symposium, 2003..
This paper describes a cost-effective reliability estimation technique that systematically characterizes components of a system based on the system behavior. This technique is an extension to that known as statistical interference theory where probab
Publikováno v:
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
A unified creep-plasticity model with damage is introduced and employed to simulate the isothermal cyclic behavior of Sn-Ag solder. The proposed damage evolution law is based on a nonlinear accumulation of damage and an interaction between applied lo
Publikováno v:
Electronics Manufacturing Issues.
The proposed model describes constitutive behavior of 63Sn-37Pb solder including effects of size, thermomechanical loading and cyclic damage. Its application to the uniaxial fatigue data shows a good agreement with the experiments.
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