Zobrazeno 1 - 10
of 619
pro vyhledávání: '"V. Semet"'
Autor:
V. Semet, Jean-Lynce Gnanago, Philippe Lombard, Jean-Fabien Capsal, Tony Gerges, Simon A. Lambert, Pierre-Jean Cottinet, Michel Cabrera
Publikováno v:
Frontiers in Physics, Vol 9 (2021)
Frontiers in Physics
Frontiers in Physics, Frontiers, 2021, 9, ⟨10.3389/fphy.2021.633848⟩
Frontiers in Physics
Frontiers in Physics, Frontiers, 2021, 9, ⟨10.3389/fphy.2021.633848⟩
Since 1995, Magnetic Resonance Elastography (MRE) has been constantly developed as a non-invasive diagnostic tool for quantitative mapping of mechanical properties of biological tissues. Indeed, mechanical properties of tissues vary over five orders
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::78d80cd6b0c6e6091c9feaef418137fb
https://www.frontiersin.org/articles/10.3389/fphy.2021.633848/full
https://www.frontiersin.org/articles/10.3389/fphy.2021.633848/full
Publikováno v:
Frontiers in Physics, Vol 8 (2020)
Frontiers in Physics
Frontiers in Physics, 2020, 8, ⟨10.3389/fphy.2020.00240⟩
Frontiers in Physics, Frontiers, 2020, 8, ⟨10.3389/fphy.2020.00240⟩
Frontiers in Physics
Frontiers in Physics, 2020, 8, ⟨10.3389/fphy.2020.00240⟩
Frontiers in Physics, Frontiers, 2020, 8, ⟨10.3389/fphy.2020.00240⟩
International audience; Over the last four decades, magnetic resonance imaging has become the gold standard imaging technique in many medical diagnoses for brain, cardiac, and liver disease. However, due to low critical mass and great scientific chal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2256a38336931a0be29d1c2a9b656ccb
https://www.frontiersin.org/article/10.3389/fphy.2020.00240/full
https://www.frontiersin.org/article/10.3389/fphy.2020.00240/full
Publikováno v:
Proceedings of the IEEE MTT-S Wireless Power Transfer Conference
2019 IEEE WPTC
2019 IEEE WPTC, Jun 2019, London, United Kingdom. pp.WPP24
2019 IEEE WPTC
2019 IEEE WPTC, Jun 2019, London, United Kingdom. pp.WPP24
Omni-directional inductive wireless power transfer to a movable target inside a half-meter cubic emitter box is studied. The innovative point is to use 3D Molded Interconnect Device (3D-MID) coils at the surface of the target with a 3D shape. Transmi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::446bd8661a56694401b4042daa51d325
https://doi.org/10.1109/wptc45513.2019.9055702
https://doi.org/10.1109/wptc45513.2019.9055702
Publikováno v:
Procedia CIRP
Procedia CIRP, ELSEVIER, 2016, 42, pp.650-655. ⟨10.1016/j.procir.2016.02.296⟩
Procedia CIRP, ELSEVIER, 2016, 42, pp.650-655. ⟨10.1016/j.procir.2016.02.296⟩
The aim of this paper is to describe some possibilities allowed by a micro EDM milling machine, which has been entirely developed in our laboratory. Among other features, this machine does not make use of WEDG for fabricating the microtools. Instead
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9ba82a009893b55b3accd46025aeda1a
https://doi.org/10.1016/j.procir.2016.02.296
https://doi.org/10.1016/j.procir.2016.02.296
Publikováno v:
2018 13th International Congress Molded Interconnect Devices (MID)
2018 13th International Congress Molded Interconnect Devices (MID), Sep 2018, Würzburg, Germany. ⟨10.1109/ICMID.2018.8526962⟩
2018 13th International Congress Molded Interconnect Devices (MID), Sep 2018, Würzburg, Germany. ⟨10.1109/ICMID.2018.8526962⟩
International audience; Omnidirectional inductive wireless charging system of a mobile is studied. Instead of using conventional planar coils printed on circuit boards, 3D Molded Interconnect Device (3D-MID) coils are used. The receiver is a single p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::14bba753c4fd04b4cabd6cea818dd4b8
https://hal.archives-ouvertes.fr/hal-02152067/document
https://hal.archives-ouvertes.fr/hal-02152067/document
Publikováno v:
2018 IEEE Wireless Power Transfer Conference
2018 IEEE WPTC
2018 IEEE WPTC, Jun 2018, Montreal, Canada. ⟨10.1109/WPT.2018.8639240⟩
2018 IEEE WPTC
2018 IEEE WPTC, Jun 2018, Montreal, Canada. ⟨10.1109/WPT.2018.8639240⟩
Omnidirectional inductive wireless charging of a $6\times 6\times 6 cm^3$ 3D receiver cube with 6 planar coils inside a $47\times 47\times 47 cm^3$ box with 4 planar emitting coils is studied. The power delivered to the cube in the central position o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3c7098446d4273e70296cf7ab2510c03
https://hal.archives-ouvertes.fr/hal-02153087
https://hal.archives-ouvertes.fr/hal-02153087
Akademický článek
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Autor:
V. Semet, Y. Layouni, P. Lombard, K. Cheval, Didier Léonard, S. Gout, Michel Cabrera, François Bessueille, Jérémy Coulm
Publikováno v:
Advanced Materials Research. 1038:57-60
The aim of this paper is to report on the use of Microcontact Printing (μCP) for the manufacturing of 3D Molded Interconnects Devices. Two different approaches are reported. A first one is based on the total metallization of the polymer, μCP of the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::847c29f9fd6db2364cd5b4c5d92a3a84
https://doi.org/10.4028/www.scientific.net/amr.1038.57
https://doi.org/10.4028/www.scientific.net/amr.1038.57
Autor:
Michel Cabrera, Sergkei Kamotesov, Mael Moguedet, Philippe Lombard, Amaury Veille, Rabah Dahmani, V. Semet, Christian Vollaire
Publikováno v:
Proceedings of the12th International Congress Molded Interconnect Devices
MID
MID, Sep 2016, Würzburg, Germany. 7738936 (6 p.), ⟨10.1109/ICMID.2016.7738936⟩
MID
MID, Sep 2016, Würzburg, Germany. 7738936 (6 p.), ⟨10.1109/ICMID.2016.7738936⟩
International audience; The modelization, fabrication and characterization of inductors using Molded Interconnect Device technology for multidirectional inductive proximity sensing is reported. Inductive proximity sensing allows contactless measureme
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::781a481e40bab9903993d9dc2e611755
https://hal.archives-ouvertes.fr/hal-01409094
https://hal.archives-ouvertes.fr/hal-01409094
Publikováno v:
Micro and Nanosystems
Micro and Nanosystems, Bentham Science Publishers, 2011, 3 (3), pp.215-221. ⟨10.2174/1876402911103030215⟩
Micro and Nanosystems, Bentham Science Publishers, 2011, 3 (3), pp.215-221. ⟨10.2174/1876402911103030215⟩
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a84b0dcaa8ca70a8335a18046a73c0c5
https://doi.org/10.2174/1876402911103030215
https://doi.org/10.2174/1876402911103030215