Zobrazeno 1 - 10
of 27
pro vyhledávání: '"V. Raballand"'
Autor:
A. von Keudell, Ana Ruiz, Hubert Rauscher, V. Raballand, J. Wunderlich, J. Opretzka, Ondřej Kylián, François Rossi, C. Dehen, Angel Yanguas-Gil, Katharina Stapelmann, Jan Benedikt, L. Byelykh, H Halfmann, Peter Awakowicz, C. Flötgen, Lylian Challier, P. Muranyi, Benjamin Denis, Lucel Sirghi, N. Hasiwa, R. Reuter, J.P. Deslys, E. Comoy
Publikováno v:
Plasma Processes and Polymers. 7:327-352
The inactivation of bacteria and biomolecules using plasma discharges were investigated within the European project BIODECON. The goal of the project was to identify and isolate inactivation mechanisms by combining dedicated beam experiments with esp
Publikováno v:
Plasma Physics and Controlled Fusion. 49:B419-B427
An RF microplasma jet working at atmospheric pressure has been developed for thin film deposition application. It consists of a capillary coaxially inserted in the ceramic tube. The capillary is excited by an RF frequency of 13.56 MHz at rms voltages
Publikováno v:
Journal of Physics D: Applied Physics
Journal of Physics D: Applied Physics, IOP Publishing, 2007, 40 (13), pp.3951. ⟨10.1088/0022-3727/40/13/007⟩
Journal of Physics D: Applied Physics, IOP Publishing, 2007, 40 (13), pp.3951. ⟨10.1088/0022-3727/40/13/007⟩
This paper focuses on plasma etching and XPS surface analyses of new dielectric materials used in integrated circuits. We investigate by XPS surface modifications of methylsilsesquioxane low-k polymer (SiOC(H)) and amorphous hydrogenated silicon carb
Publikováno v:
The European Physical Journal Applied Physics. 28:331-337
Low dielectric constant materials (low-k) are used as interlevel dielectrics in integrated circuits. This paper concerns the etching process of these materials in high density plasma with the aim to provide some insights concerning the etch mechanism
Publikováno v:
Plasma Processes and Polymers
Plasma Processes and Polymers, Wiley-VCH Verlag, 2007, 4 (5), pp.563. ⟨10.1002/ppap.200600218⟩
Plasma Processes and Polymers, Wiley-VCH Verlag, 2007, 4 (5), pp.563. ⟨10.1002/ppap.200600218⟩
The effect of radio frequency bias pulsing on porous SiOCH, SiCH and SiO 2 etching using inductively coupled fluorocarbon plasmas was investigated. It was found that pulse frequency had only a small influence on material etch rates. However, pulse du
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ec5fcf9140d7d20c0af4c85179a630f1
https://hal.archives-ouvertes.fr/hal-00391906
https://hal.archives-ouvertes.fr/hal-00391906
Autor:
Ch. Cardinaud, Thomas Begou, Bruno Bêche, Jean-Pierre Landesman, Etienne Gaviot, V. Raballand, Antoine Goullet, Joseph Zyss, Agnès Granier
Publikováno v:
IEEE conference publications
IEEE conference publications, 2006, IEEE Industrial Electronics, ⟨10.1109/IECON.2006.347474⟩
IEEE conference publications, 2006, IEEE Industrial Electronics, ⟨10.1109/IECON.2006.347474⟩
International audience; The authors present the design, realization and characterization of photonics integrated circuits made up of organosilicon (SiOx CyHz) materials called HexaMethylDiSilOxane plasma polymers (pp-HMDSO), elaborated by plasma enha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0cfc151132fde20397de9e0a4f110e44
https://hal.archives-ouvertes.fr/hal-01552413
https://hal.archives-ouvertes.fr/hal-01552413
Autor:
David Eon, Panagiotis Argitis, Evangelos Gogolides, Nikolaos Vourdas, V. Raballand, Gilles Cartry, Christophe Cardinaud
Publikováno v:
Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures
Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures, American Vacuum Society (AVS), 2006, 24, pp.2678. ⟨10.1116/1.2382947⟩
Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures, American Vacuum Society (AVS), 2006, 24, pp.2678. ⟨10.1116/1.2382947⟩
International audience; Copolymers containing polyhedral oligomeric silsesquioxane (POSS™) units have been developed to be used as photoresist components in a bilayer resist scheme for 193 nm lithography. This article reports on the behavior of the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::868ac199fbc4e507d4e804a0fd8a99c1
https://hal.archives-ouvertes.fr/hal-00379618/file/eon2006.pdf
https://hal.archives-ouvertes.fr/hal-00379618/file/eon2006.pdf
Publikováno v:
Scopus-Elsevier
Summary form only given. There has been much interest in inductively coupled plasmas for semiconductor processing and for integrated optic applications. We are concerned with several processes using Inductively Coupled Plasma, such as deep silicon ox
Publikováno v:
Journal of Applied Physics. 105:083304
Organic and inorganic silicon dioxide films have been deposited by means of an atmospheric pressure microplasma jet. Tetramethylsilane (TMS), oxygen, and hexamethyldisiloxane (HMDSO) are injected into argon as plasma forming gases. In the case of TMS
Publikováno v:
Journal of Physics D: Applied Physics. 41:115207
The inactivation of spores of Bacillus atrophaeus and of Aspergillus niger using beams of argon ions, of oxygen molecules and of oxygen atoms is studied. Thereby, the conditions occurring in oxygen containing low pressure plasmas are mimicked and fun