Zobrazeno 1 - 10
of 22
pro vyhledávání: '"V. Quy"'
Autor:
Nguyen V. Quy1 (AUTHOR), Hop, Nguyen V.2 (AUTHOR), Pham, Mai-Phuong3 (AUTHOR), Nguyen, Hong-Hai2 (AUTHOR) hainh@vnuf.edu.vn
Publikováno v:
Biology Bulletin. 2023 Suppl 4, Vol. 50, pS717-S733. 17p.
Publikováno v:
ACS Omega, Vol 6, Iss 24, Pp 16151-16158 (2021)
Externí odkaz:
https://doaj.org/article/da9859e69ce246eda83d440e866e91d2
Autor:
Hoang V. Quy, Chung W. Bark
Publikováno v:
ACS Omega. 7:22256-22262
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38b077faa8049f4afd76e67383c87574
https://doi.org/10.1021/acsomega.2c00965
https://doi.org/10.1021/acsomega.2c00965
Autor:
Hoang V, Quy, Chung W, Bark
Publikováno v:
ACS omega. 7(26)
Perovskite solar cells (PSCs) based on a planar structure have recently become more attractive due to their simple manufacturing process and relatively low cost, while most perovskite solar cells employ highly porous TiO
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::9cad224fa7639b7739d606d609fc437e
https://pubmed.ncbi.nlm.nih.gov/35811856
https://pubmed.ncbi.nlm.nih.gov/35811856
Autor:
Kazuo Kondo, V Quy Dinh
Publikováno v:
ECS Meeting Abstracts. :1779-1779
1. Introduction Since the Copper resistivity is second lowest next to the Silver, the Copper electrodeposits have been very intensively used in the wiring for the semiconductor and the printed circuit board (PCB). The Copper problem is the thermal co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4933771068a830510e94eb04443cb00f
https://doi.org/10.1149/ma2020-02251779mtgabs
https://doi.org/10.1149/ma2020-02251779mtgabs
Autor:
J. T. L. Zwart, R. W. Barker, P. Biddulph, D. Bly, R. C. Boysen, A. R. Brown, C. Clementson, M. Crofts, T. L. Culverhouse, J. Czeres, R. J. Dace, M. L. Davies, R. D'Alessandro, P. Doherty, K. Duggan, J. A. Ely, M. Felvus, F. Feroz, W. Flynn, T. M. O. Franzen, J. Geisbüsch, R. Génova-Santos, K. J. B. Grainge, W. F. Grainger, D. Hammett, R. E. Hills, M. P. Hobson, C. M. Holler, N. Hurley-Walker, R. Jilley, M. E. Jones, T. Kaneko, R. Kneissl, K. Lancaster, A. N. Lasenby, P. J. Marshall, F. Newton, O. Norris, I. Northrop, D. M. Odell, G. Petencin, J. C. Pober, G. G. Pooley, M. W. Pospieszalski, V. Quy, C. Rodríguez-Gonzálvez, R. D. E. Saunders, A. M. M. Scaife, J. Schofield, P. F. Scott, C. Shaw, T. W. Shimwell, H. Smith, A. C. Taylor, D. J. Titterington, M. Velić, E. M. Waldram, S. West, B. A. Wood, G. Yassin
The Arcminute Microkelvin Imager is a pair of interferometer arrays operating with six frequency channels spanning 13.9-18.2 GHz, with very high sensitivity to angular scales 30''-10'. The telescope is aimed principally at Sunyaev-Zel'dovich imaging
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::66866ac53f4027b07f6fe9d687dc394f
https://ora.ox.ac.uk/objects/uuid:ea6ae415-3f83-4b3d-aa4f-b10100fd51f8
https://ora.ox.ac.uk/objects/uuid:ea6ae415-3f83-4b3d-aa4f-b10100fd51f8
Autor:
M. Crofts, Jonathan T. L. Zwart, D. M. Odell, Natasha Hurley-Walker, John Ely, J. Czeres, M. L. Davies, Roger Dace, Harry Smith, Anthony Lasenby, E. M. Waldram, M. Olamaie, M. Felvus, Keith Grainge, Michael L. Brown, Michael P. Hobson, O. Norris, W. Flynn, D. Bly, T. Culverhouse, William F. Grainger, Ghassan Yassin, Richard D. E. Saunders, V. Quy, Philip J. Marshall, P. Biddulph, Timothy W. Shimwell, Ricardo Génova-Santos, A. R. Brown, Anna M. M. Scaife, J. Schofield, C. M. Holler, R. Jilley, R. W. Barker, M. Velić, David Titterington, Guy G. Pooley, J. Geisbüsch, B. A. Wood, R. D'Alessandro, D. Hammett, F. Newton, S. West, C. Rodriguez-Gonzalvez, C. Clementson, Michel P. Schammel, Paul F. Scott, C. Shaw, Marian Pospieszalski, T. Kaneko, Roger C. Boysen, Farhan Feroz, T. M. O. Franzen, R. Kneissl, Y. C. Perrott J. C. Pober, K. Duggan, Katy Lancaster, I. Northrop, P. Doherty
Publikováno v:
Monthly Notices of the Royal Astronomical Society. 423:1463-1473
We present an interesting Sunyaev-Zel'dovich (SZ) detection in the first of the Arcminute Microkelvin Imager (AMI) 'blind', degree-square fields to have been observed down to our target sensitivity of 100{\mu}Jy/beam. In follow-up deep pointed observ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::314e5a91efc059fa4761627da718db24
https://doi.org/10.1111/j.1365-2966.2012.20970.x
https://doi.org/10.1111/j.1365-2966.2012.20970.x
Publikováno v:
ECS Meeting Abstracts. :1115-1115
Introduction Copper through-silicon via (TSV) is the key technology used in 3D packaging. However, the large mismatch in thermal expansion coefficient (TEC) between copper and silicon generates the thermomechanical stress inside and surround the TSV
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1fec784b671ba2afebe7a32dfc9b8557
https://doi.org/10.1149/ma2018-02/33/1115
https://doi.org/10.1149/ma2018-02/33/1115
Autor:
D C Cavanaugh, S Vivona, R J Joy, J. D. Marshall, D V Quy, P. E. Winter, D. H. Hunter, H G Dangerfield
Publikováno v:
American Journal of Public Health and the Nations Health. 58:742-752
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d9328d82e6ef42782de8a0a33dd3a5b2
https://doi.org/10.2105/ajph.58.4.742
https://doi.org/10.2105/ajph.58.4.742
Publikováno v:
American Journal of Epidemiology. 86:603-616
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cbb0b856c3129dcc52a906e5319a8eb5
https://doi.org/10.1093/oxfordjournals.aje.a120770
https://doi.org/10.1093/oxfordjournals.aje.a120770