Zobrazeno 1 - 10
of 26
pro vyhledávání: '"V. Ontalus"'
Publikováno v:
2017 17th International Workshop on Junction Technology (IWJT).
In planar device technology, shallow junction is a structure to control source to drain off current leakage when the gate becomes narrow to keep up with scaling of semiconductor device. High spatial resolution characterization of the device junction
Publikováno v:
Key Engineering Materials. :1131-1134
Publikováno v:
Journal of Materials Science. 31:3639-3642
Pb(Zr0.53Ti0.47)O3 (PZT) thin films, prepared by sol-gel techniques and deposited on to Si/SiO2/Ti/Pt substrates, have been subjected to thermal annealing in a range of temperatures from 550–800 °C. The crystallization behaviour and phase coexiste
Publikováno v:
Microscopy and Microanalysis. 20:252-253
Autor:
P. Agnello, T. Ivers, C. Warm, R. Wise, R. Wachnik, D. Schepis, S. Sankaran, J. Norum, S. Luning, Y. Li, M. Khare, A. Grill, D. Edelstein, X. Chen, D. Brown, R. Augur, S. Wu, J. Yu, R.C. Wong, J. Werking, D. Wehella-Gamage, A. Vayshenker, H. Van Meer, R. Van Den Nieuwenhuizen, C. Tian, K. Tabakman, C.Y. Sung, T. Standaert, A. Simon, J. Sim, C. Sheraw, D. Restaino, W. Rausch, R. Pal, C. Prindle, X. Ouyang, C. Ouyang, V. Ontalus, K. Nummy, D. Nielsen, L. Nicholson, A. McKnight, N. Lustig, X. Liu, M.H. Lee, D. Lea, G. Larosa, W. Landers, B. Kim, M. Kelling, S.-J. Jeng, J. Holt, M. Hargrove, S. Grunow, S. Greco, S. Gates, A. Frye, P. Fisher, A. Domenicucci, C. Dimitrakopoulos, G. Costrini, A. Chou, J. Cheng, S. Butt, L. Black, M. Belyansky, I. Ahsan, T. Adam, A. Gabor, C.-H.J. Wu, D. Yang, M. Crouse, C. Robinson, D. Corliss, C. Fonseca, J. Johnson, M. Weybright, A. Waite, H.M. Nayfeh, K. Onishi, S. Narasimha
Publikováno v:
2006 International Electron Devices Meeting.
We present a 45-nm SOI CMOS technology that features: i) aggressive ground-rule (GR) scaling enabled by 1.2NA/193nm immersion lithography, ii) high-performance FET response enabled by the integration of multiple advanced strain and activation techniq
Publikováno v:
2006 IEEE International Reliability Physics Symposium Proceedings.
It was previously demonstrated that SOI MOSFET devices are more robust with respect to plasma process charging damage than bulk MOSFET devices. In this work, charging damage to the gate dielectric of an SOI device is induced by attaching different-ar
Publikováno v:
1995 International Semiconductor Conference. CAS '95 Proceedings.
The changes in the structural composition of each phase (sol, powder, film) of sol-gel derived PbTiO/sub 3/ (PT) are reported as a function of thermal processing conditions and of type of catalysts introduced. The dense amorphous layers turn into cry
Publikováno v:
Journal of Applied Physics. 116:174501
Applicability of electron holography to deep submicron Si devices with epitaxial layers is limited due to lack of the mean inner potential data and effects of the sample tilt. The mean inner potential V0 = 12.75 V of the intrinsic epitaxial SiGe was
Autor:
Kathryn T. Schonenberg, Paul Ronsheim, Michael A. Gribelyuk, T. N. Adam, V. Ontalus, Jun Yuan
Publikováno v:
Microscopy and Microanalysis. 16:568-569
Extended abstract of a paper presented at Microscopy and Microanalysis 2010 in Portland, Oregon, USA, August 1 – August 5, 2010.
Autor:
P. R. Ronsheim, Kathryn T. Schonenberg, T. N. Adam, V. Ontalus, L. Kimball, Michael A. Gribelyuk
Publikováno v:
Journal of Applied Physics. 110:063522
Microstructure of Si1-xCx films grown epitaxially onto Si wafers was studied. Clusters formed by Si and interstitial carbon were observed in Si1-xCx films by transmission electron microscopy. It was found that the cluster size increases with the tota