Zobrazeno 1 - 10
of 13
pro vyhledávání: '"V. M. Roshchin"'
Publikováno v:
Inorganic Materials. 56:254-257
We report the electrochemical deposition of Sn–Ni and In–Ni alloys containing 20 and 45 wt % of the lower melting point component. The percentage of nickel in the deposited alloys has been determined by gravimetric analysis. We have studied the t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7312bd56c49c4f1c1073092fdf41635
https://doi.org/10.1134/s0020168520030176
https://doi.org/10.1134/s0020168520030176
Publikováno v:
Russian Microelectronics. 46:454-457
The technological capabilities of the layer-by-layer electrochemical formation of vertical contact structures based on a copper–tin system for mounting silicon chips, including 3D technologies, have been considered. The possibility of fixing a chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a0307add7f08c4712ea1b1d7b8ef7e1
https://doi.org/10.1134/s1063739717070095
https://doi.org/10.1134/s1063739717070095
Publikováno v:
2019 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (EIConRus).
The autocatalytic process of nickel coating formation is considered in this paper. Sodium hypophosphite was used as a reducing agent. Based on the data of gravimetric and photometric analyses the temperature dependence of phosphorus incorporation int
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb2b94d3b6370b61ee9efc3870fd6366
https://doi.org/10.1109/eiconrus.2019.8657192
https://doi.org/10.1109/eiconrus.2019.8657192
Publikováno v:
Inorganic Materials. 52:1220-1223
In this paper, we report a detailed study of the thermal properties of a peritectic Ag–Sn alloy electrochemically deposited onto copper and titanium plates in order to produce soldered contact structures. A comparative analysis of Ag and Sn codepos
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b08d9c26d2f6448c6d2d065c69e2e966
https://doi.org/10.1134/s0020168516110091
https://doi.org/10.1134/s0020168516110091
Publikováno v:
Russian Microelectronics. 45:324-328
Physicochemical aspects of the electrochemical formation of vertical contact structures of the Sn–Ag peritectic composition for chipping integrated microcircuits by the inverted crystal method are considered. The layer-by-layer deposition of metals
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9837e138f7286321cd1abf098e0eb290
https://doi.org/10.1134/s1063739716040090
https://doi.org/10.1134/s1063739716040090
Publikováno v:
2018 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (EIConRus).
The article presents the results of studies of the technology of obtaining nanoheterogeneous silver-carbon structure on various substrates and the measurement of the electrophysical parameters experimental samples. The evolution of this system during
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc541d5cd904a7dd15c15d145350d81e
https://doi.org/10.1109/eiconrus.2018.8317415
https://doi.org/10.1109/eiconrus.2018.8317415
Publikováno v:
Inorganic Materials. 51:294-298
This paper considers electrochemical tin deposition for producing contact elements in integrated circuit packaging. We examine the effect of organic additives to sulfate electrolytes on the growth of local vertical structures, with the aim of suppres
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f1830da3b02dadb3facc3a42dd0e4e7
https://doi.org/10.1134/s0020168515030139
https://doi.org/10.1134/s0020168515030139
Publikováno v:
2017 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (EIConRus).
In this work there have been studied the processes of co-deposition and layer-by-layer electrochemical deposition of tin-silver alloys of the given composition with near-eutectic and peritectic content of components. To predict the thermal stability
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0d2d3167960a120037a7d1954a4d413
https://doi.org/10.1109/eiconrus.2017.7910769
https://doi.org/10.1109/eiconrus.2017.7910769
Publikováno v:
2017 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (EIConRus).
The article describes the application of electrochemical methods of analysis to predict the nature of oxidation-reduction reactions in the processes of chemical and electrochemical formation of solder materials for high-density circuit wiring of micr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c86192a8780bcf36c966e1600d3205e
https://doi.org/10.1109/eiconrus.2017.7910774
https://doi.org/10.1109/eiconrus.2017.7910774
Publikováno v:
Semiconductors. 48:1704-1709
The effect of the morphology of metal-ferroelectric-metal interfaces on their electrical properties is studied. The effect of buffer layers and methods for depositing electrodes on ferroelectric-film morphology are experimentally studied. A theoretic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f32a1d86c0e98b562c9f598514ad921
https://doi.org/10.1134/s1063782614130120
https://doi.org/10.1134/s1063782614130120