Zobrazeno 1 - 4
of 4
pro vyhledávání: '"V. K. Maudgal"'
Publikováno v:
Journal of Electronic Packaging. 112:350-356
This study examines experimentally the quality of contact of mechanical joints in a diode heat sink assembly. Steady-state contact conductance, h, is used as a quantitative measure of the quality of contact of a joint. The emphasis of the work is on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::23400dfc5aa4bf665aa4168b720d52ac
https://doi.org/10.1115/1.2904389
https://doi.org/10.1115/1.2904389
Autor:
Maudgal, V.K., Sunderland, J.E.
Publikováno v:
Thirteenth Annual IEEE Semiconductor Thermal Measurement & Management Symposium; 1997, p149-157, 9p
Autor:
Siebert, W. Peter
Publikováno v:
IEEE Transactions on Components & Packaging Technologies; Mar2006, Vol. 29 Issue 1, p155-163, 9p, 1 Black and White Photograph, 12 Diagrams, 4 Charts
Autor:
Jonsson, Hans, Moshfegh, Bahram
Publikováno v:
IEEE Transactions on Components & Packaging Technologies; Jun2001, Vol. 24 Issue 2, p142, 8p, 6 Diagrams, 5 Charts, 6 Graphs