Zobrazeno 1 - 10
of 12
pro vyhledávání: '"V. I. Tuev"'
Publikováno v:
Proceedings of Tomsk State University of Control Systems and Radioelectronics. 21:77-82
Publikováno v:
Proceedings of Tomsk State University of Control Systems and Radioelectronics. 20:148-151
Autor:
V M Korotaev, V I Tuev
Publikováno v:
Journal of Physics: Conference Series. 1499:012041
The results of the study of directional microwave couplers under conditions of extreme changes in load parameters are presented. Models are proposed in the form of equivalent circuits, mathematical relationships are obtained connecting the parameters
Publikováno v:
IOP Conference Series: Earth and Environmental Science. 224:012048
Publikováno v:
2016 13th International Scientific-Technical Conference on Actual Problems of Electronics Instrument Engineering (APEIE).
This paper describes experiments on the study of light intensity curve (LIC) support structures LED lights with four emitting elements, mounted in a glass bulb incandescent lamps with E27 base. Comparison LIC support structures design, mass-produced
Publikováno v:
AIP Conference Proceedings.
A synthesis technique of low-temperature ceramic material based on aluminosilicates of dendrimer morphology capable to contain up to 80 wt % of nitrides and oxides of high-melting compounds as filler has been developed. The synthesis is based on a so
Publikováno v:
Journal of Physics: Conference Series. 1115:052012
Publikováno v:
2015 IV Forum Strategic Partnership of Universities and Enterprises of Hi-Tech Branches (Science. Education. Innovations).
The article shows the study cycle results to develop the additive technology to produce a thin organic and inorganic material film. The experience to implement the ultrasonic capillary liquid application to produce a full-color passive OLED matrix (P
Autor:
V. I. Tuev, A. A. Ivanov
Publikováno v:
AIP Conference Proceedings.
The copolymer of the vinyl chloride-maleic anhydride and silver nano- and microparticle (70 wt %) composition is offered as a conductive adhesive for fixing various chips on the dielectric substrate. The wiring volume resistivity is up to 3.1×10−8
Autor:
A. A. Ivanov, V. I. Tuev
Publikováno v:
AIP Conference Proceedings.
New aluminosilicate filled with aluminum oxyhydroxide (AlO(OH)) is offered as a dielectric substrate (DS) for LED devices. The DS obtained from these substances has high thermal conductivity up to λ = 133.61 W/m×K and its value depends on the amoun