Zobrazeno 1 - 10
of 252
pro vyhledávání: '"V. Hause"'
Autor:
Kumar, Ravinder1 (AUTHOR) raj86tau@gmail.com, Kumar, Piyush2 (AUTHOR) krpiyush247@gmail.com
Publikováno v:
Encyclopedia. Sep2024, Vol. 4 Issue 3, p1062-1072. 11p.
Publikováno v:
IEEE Transactions on Advanced Packaging. 23:582-587
While trends in semiconductor packages continue toward a decrease in overall package size and an increase in functionality and performance requirements, the challenge of maintaining and improving reliability is a critical aspect. In practice, die str
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 17:573-582
The quad flat package (QFP) finds wide use in current electronic systems, PCs, and workstations, housing a variety of devices. This study projects the thermal performance limits of the QFP family. The metrics chosen are the maximum power dissipated f
Publikováno v:
InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V.
This experimental study was undertaken to demonstrate the capability of liquid-encapsulated system in its simplest form of implementation to cool a multichip module (MCM) package. The MCM package was made of kovar (dimension: 58/spl times/35/spl time
Publikováno v:
Manufacturing Engineering.
This study characterizes the thermal performance of the Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package (HP-VFQFP-N) family for GaAs-based RF power amplifier applications. This package uses perimeter lands on the bottom of t
Autor:
Nie, Hui1,2 (AUTHOR), Luo, Yanghe1,2 (AUTHOR), Huang, Shuangquan1 (AUTHOR), Mo, Yuwei1 (AUTHOR), Huang, Zhenli1 (AUTHOR), Liao, Yuemei1 (AUTHOR), Jiang, Lirui1 (AUTHOR), Cai, Wen1 (AUTHOR) caiwen@hzxy.edu.cn, Song, Mubo1 (AUTHOR) songmubo1@163.com
Publikováno v:
Food Science & Nutrition. Sep2023, Vol. 11 Issue 9, p5166-5173. 8p.
Autor:
Du, Pingzhou1 (AUTHOR), Liu, Yu1 (AUTHOR), Deng, Lu1 (AUTHOR), Qian, Dong2 (AUTHOR), Xue, Xiuhua1 (AUTHOR), Yang, Ting1 (AUTHOR), Li, Tonghui1 (AUTHOR), Xiang, Yun2 (AUTHOR) xiangy@lzu.edu.cn, Ren, Haiyun1 (AUTHOR) hren@bnu.edu.cn
Publikováno v:
Journal of Integrative Plant Biology. Aug2023, Vol. 65 Issue 8, p1950-1965. 16p.
Autor:
Kornpointner, Christoph1,2 (AUTHOR), Hochenegger, Nadine J.2 (AUTHOR), Shi, Bao-Bao3 (AUTHOR), Berger, Andreas4 (AUTHOR), Theiner, Johannes5 (AUTHOR), Brecker, Lothar1 (AUTHOR) lothar.brecker@univie.ac.at, Schinnerl, Johann4 (AUTHOR) lothar.brecker@univie.ac.at
Publikováno v:
Molecules. Nov2022, Vol. 27 Issue 21, p7284. 15p.
Publikováno v:
Federal Register (National Archives & Records Service, Office of the Federal Register). 4/19/2024, Vol. 89 Issue 77, pI-iv. 687p.
Autor:
Ho-Plágaro, Tania1 (AUTHOR) tania.ho@eez.csic.es, García-Garrido, José Manuel1 (AUTHOR) josemanuel.garcia@eez.csic.es
Publikováno v:
International Journal of Molecular Sciences. Jun2022, Vol. 23 Issue 11, p5960-5960. 20p.