Zobrazeno 1 - 8
of 8
pro vyhledávání: '"V. H. Adams"'
Publikováno v:
Journal of Heat Transfer. 121:992-1001
Three-dimensional natural convection flow and heat transfer were numerically studied for a three-by-three array of discrete protruding heat sources on a horizontal substrate in an air-filled, rectangular, narrow-aspect-ratio enclosure with length, wi
Issues in validating package compact thermal models for natural convection cooled electronic systems
Publikováno v:
Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.
A methodology is proposed for the validation of compact thermal models of electronic packages which utilizes data and simulations obtained from a simple but realistic system containing the package. The test system used to demonstrate the methodology
Autor:
V. H. Adams, T.-Y. Tom Lee
Publikováno v:
Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques.
Alternative interconnect strategies are being considered in place of the standard wire bond interconnect for GaAs power amplifier MMIC devices due to cost and electrical performance improvements. The package/die thermal performance consequences are p
Publikováno v:
Manufacturing Engineering.
This study characterizes the thermal performance of the Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package (HP-VFQFP-N) family for GaAs-based RF power amplifier applications. This package uses perimeter lands on the bottom of t
Publikováno v:
Manufacturing Engineering.
Computational Fluid Dynamics (CFD) simulations were conducted to characterize the thermal performance of Molded Array Plastic Ball Grid Array (MAP PBGA) packages for hand-held applications. Due to size constraints, these PBGA packages tend to have fi
Autor:
V. H. Adams, K. Ramakrishna
Publikováno v:
Electronics Manufacturing Issues.
Simulations for thermal characterization of electronic packages for silicon-based integrated circuit (IC) components typically assume one of the two uniform heat generation conditions. They are: (1) an isoflux condition in which heat generation is un
Autor:
D. J. Fraade, V. H. Adams
Publikováno v:
IRE Transactions on Industrial Electronics. :1-9
Autor:
G P Bridges, V H Adams
Publikováno v:
The Institution of Civil Engineers Engineering Division Papers. 9:19-21