Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Vähänen, Sami"'
Autor:
Kalliopuska, Juha, Nenonen, Seppo, Sipilä, Heikki, Andersson, Hans, Vähänen, Sami, Eränen, Simo, Tlustos, Lukas
Publikováno v:
In Nuclear Inst. and Methods in Physics Research, A 2009 607(1):98-102
Autor:
Kostamo, Pasi, Nenonen, Seppo, Vähänen, Sami, Tlustos, Lukas, Fröjdh, Christer, Campbell, Michael, Zhilyaev, Yuri, Lipsanen, Harri
Publikováno v:
In Nuclear Inst. and Methods in Physics Research, A 2008 591(1):174-177
Publikováno v:
In Nuclear Inst. and Methods in Physics Research, A 2006 565(1):314-319
Autor:
Gädda, Akiko, Salonen, Jaakko, Vähänen, Sami, Monnoyer, Philippe, Heikkinen, Hannele, Pohjonen, Harri, Eränen, Simo
Publikováno v:
Gädda, A, Salonen, J, Vähänen, S, Monnoyer, P, Heikkinen, H, Pohjonen, H & Eränen, S 2012, Modeling of the underfill flow process in the flip chip bonded pixel detectors . in J Kutilainen (ed.), Proceedings : IMAPS Nordic Conference 2012 . IMAPS Nordic, pp. 82-85, IMAPS Nordic Annual Conference 2012, Helsingor, Denmark, 2/09/12 .
Modeling of the underfilling process of the flip chip bonded components has been studied. The size of the hybridized pixel detectors used in the flip chip bonding process varied up to 1 cm * 1.6 cm. An underfill was required to enhance the mechanical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=355e65625b88::b0003e54dedb32deee62a27f2924580b
https://cris.vtt.fi/en/publications/60baae16-83e4-4b54-b275-fc8250c271f5
https://cris.vtt.fi/en/publications/60baae16-83e4-4b54-b275-fc8250c271f5
Autor:
Gädda, Akiko, Salonen, Jaakko, Suni, Tommi, Vähänen, Sami, Monnoyer, Philippe, Heikkinen, Hannele, Pohjonen, Harri
Publikováno v:
Gädda, A, Salonen, J, Suni, T, Vähänen, S, Monnoyer, P, Heikkinen, H & Pohjonen, H 2011, Electroless Nickel and Immersion Gold deposition on Single Chips for Flip Chip Assembly of Pixel Detectors . in J Kutilainen (ed.), IMAPS Nordic Annual Conference 2011 . Curran Associates Inc., Finland, pp. 36-44, IMAPS Nordic Annual Conference 2011, Espoo, Finland, 5/06/11 .
Single chip handling has received significant attention for the diced chip without an Under Bump Metallization (UBM). In many cases, the Electroless Nickel Immersion Gold (ENIG) process is a suitable method to deposit UBM layer. Especially creating a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=355e65625b88::9672cd65e340dd9c606f62f806c1f0bb
https://cris.vtt.fi/en/publications/94cba9cb-2fe3-4330-9649-eac172420e70
https://cris.vtt.fi/en/publications/94cba9cb-2fe3-4330-9649-eac172420e70
Autor:
Kalliopuska, Juha, Eränen, Simo, Virolainen, Tuula, Vähänen, Sami, Orava, Risto, van Remortel, Nick, Garcia, Francisco, Santala, Marko, Fan, Ji: Nenonen, Seppo, Andersson, Hans
Publikováno v:
Kalliopuska, J, Eränen, S, Virolainen, T, Vähänen, S, Orava, R, van Remortel, N, Garcia, F, Santala, M, Fan, J N S & Andersson, H 2009, ' Radiation Detector Activity at VTT ', Paper presented at 43rd annual meeting of the Finnish Physical Society, Espoo, Finland, 12/03/09-14/03/09 .
VTT is a nonprofit research organization employing about 2700 persons. It is the largest R&D institution in Northern Europe and is part of the Finnish innovation system. VTT has a two decades experience, since 1989, on manufacturing and designing sil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=355e65625b88::676dc7aa12e8e3cab5640ca41cfacded
https://cris.vtt.fi/en/publications/fef24878-0977-4ce1-b6a3-a5fb8d29601f
https://cris.vtt.fi/en/publications/fef24878-0977-4ce1-b6a3-a5fb8d29601f
Publikováno v:
Savolainen-Pulli, S, Salmi, J, Vähänen, S & Salonen, J 2005, Ultra-fine flip chip technology at VTT . in Eltupak 2005 . Tampere University of Technology, Tampereen teknillinen yliopisto: Porin yksikkö. Julkaisu, no. 3, pp. 132-138, Elektroniikan tuotanto-ja pakkaustekniikan konferenssi, ELTUPAK 2005, Pori, Finland, 19/05/05 .
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=355e65625b88::7b02670fbb3ee7739eb9072620ca97b9
https://cris.vtt.fi/en/publications/fce82937-9cef-4f9e-b071-8d4d633cfeef
https://cris.vtt.fi/en/publications/fce82937-9cef-4f9e-b071-8d4d633cfeef
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Akademický článek
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Publikováno v:
ECS Journal of Solid State Science and Technology; January 2012, Vol. 1 Issue: 3