Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Uwe Knochel"'
Publikováno v:
IEEE Design & Test. 30:59-69
This paper discusses the complexity of integration of dies from multiple semiconductor manufacturers in 3D stacks with each die providing different functionality, e.g., analog, digital, RF, etc. The authors show how an XMLbased infrastructure for dat
Autor:
Uwe Knochel
Publikováno v:
DDECS
More than Moore technologies like 3D-integration enable the dense integration of different circuits. With the right partitioning of functional units in a die stack; the system performance can be increased and the power consumption reduced. Design of
Publikováno v:
Entwurf integrierter 3D-Systeme der Elektronik ISBN: 9783642305719
Die Beschreibung und der Austausch von Geometrie- und Materialdaten nehmen im 3D-Entwurf eine wichtige Rolle ein. Ein Problem dabei stellen fehlende Datenformate zur einheitlichen Definition und Speicherung der Entwurfsdaten dar. Deshalb wird in dies
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c0a0f2e4786d0541aa1b9fac9bcb193
https://doi.org/10.1007/978-3-642-30572-6_7
https://doi.org/10.1007/978-3-642-30572-6_7
Publikováno v:
2010 XIth International Workshop on Symbolic and Numerical Methods, Modeling and Applications to Circuit Design (SM2ACD).
This article presents a new approach to fast mixed-mode simulation of phase-locked loops (PLLs) in time domain using Spice-like simulators and behavioral Verilog-A baseband (BB) models of voltage-controlled oscillators (VCO) and frequency dividers (F
Autor:
Ronny Frevert, Joachim Haase, Roland Jancke, Uwe Knochel, Peter Schwarz, Ralf Kakerow, Mohsen Darianian
Modern telecommunication systems are highly complex from an algorithmic point of view. The complexity continues to increase due to advanced modulation schemes, multiple protocols and standards, as well as additional functionality such as personal org