Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Umur Caglar"'
Publikováno v:
Technological Forecasting and Social Change. 151:119779
At a time when many mature industries have been fundamentally transformed by disruptive innovations, prominent examples such as Apple and Uber reflect how disruptive innovations often originate at the ecosystem or system level rather than in individu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1db6dc69c8de52ac881d09bbc95e4053
https://doi.org/10.1016/j.techfore.2019.119779
https://doi.org/10.1016/j.techfore.2019.119779
Autor:
Pauliina Mansikkamaki, Esa Kunnari, Eerik Halonen, Santtu Koskinen, Umur Caglar, Ville Pekkanen, Matti Mäntysalo, Juha Niittynen, Katja Laine, Kimmo Kaija
Publikováno v:
Microelectronic Engineering. 87:2382-2390
The printed interconnections for encapsulated electronic packages using nanoparticle metal inks and polymer dielectrics have been demonstrated. The printing has utilized a digital printing method, inkjet printing. The printing process has been adopte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7d06a23b43d990ac40ce014fca8b2c4
https://doi.org/10.1016/j.mee.2010.04.013
https://doi.org/10.1016/j.mee.2010.04.013
Autor:
Umur Caglar, Pauliina Mansikkamäki
Publikováno v:
Journal of Nanoelectronics and Optoelectronics. 3:195-198
Dielectric materials are used in a wide variety of electronic devices, such as transistors, diodes, capacitors and resistors. Even though there are already many materials available, suppliers are striving to produce novel dielectric materials to supp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac10ab2ffb21286e3a72beb9487bbcc1
https://doi.org/10.1166/jno.2008.215
https://doi.org/10.1166/jno.2008.215
Autor:
Umur Caglar, Pauliina Mansikkamäki
Publikováno v:
NIP & Digital Fabrication Conference. 24:387-390
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60f5abd38d2d0cbc310961a21bcdc1b3
https://doi.org/10.2352/issn.2169-4451.2008.24.1.art00100_1
https://doi.org/10.2352/issn.2169-4451.2008.24.1.art00100_1
Publikováno v:
Ceramic Integration and Joining Technologies: From Macro to Nanoscale
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8fc7b09dc3bbf7911fe74d92d39a155b
https://doi.org/10.1002/9781118056776.ch23
https://doi.org/10.1002/9781118056776.ch23
Publikováno v:
2008 2nd IEEE International Nanoelectronics Conference.
We report the mechanical performance of the structure of sintered silver ink used in inkjet printing, having a particle size of 3-7 nm. Tensile adhesion pull-off testing together with the optimized related ISO and ASTM industrial standards were used.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cbe174101f229fc6dca53b035bb73878
https://doi.org/10.1109/inec.2008.4585617
https://doi.org/10.1109/inec.2008.4585617
Publikováno v:
International Journal of Nanotechnology. 6:681
In this paper, we evaluated two different silver inks that differ about their particle size and used components in ink onto several commonly used substrates in the printed electronics, i.e., PEN, PI, PET, and LCP. Several sintering temperatures and d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2698d4c035c80a94c0e428359ba3581c
https://doi.org/10.1504/ijnt.2009.025306
https://doi.org/10.1504/ijnt.2009.025306