Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Ulrike Heitmann"'
Autor:
Ulrike Heitmann, Johan Westraadt, Jacques O’Connell, Leonie Jakob, Frank Dimroth, Jonas Bartsch, Stefan Janz, Jan Neethling
Publikováno v:
ACS Applied Materials & Interfaces. 14:41149-41155
Sprayed transparent conductive oxides (TCOs) are an interesting alternative to sputtered TCOs for many applications due to the possible high throughput and a simple, atmospheric pressure process of spray deposition. In this work, the growth mechanism
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a8f03ab8c76672ffe9c6e29cebfd4df6
https://doi.org/10.1021/acsami.2c07585
https://doi.org/10.1021/acsami.2c07585
Autor:
Radwa Elgazzar, Ulrike Heitmann, Leonie Jakob, Benedikt Bläsi, Oliver Höhn, Sven Kluska, Jonas Bartsch
Publikováno v:
SiliconPV 2021, The 11th International Conference on Crystalline Silicon Photovoltaics.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::463dc233062e93c71a7ed016b94db5df
https://doi.org/10.1063/5.0097051
https://doi.org/10.1063/5.0097051
Autor:
Sven Kluska, Stefan Janz, Jana Wulf, Ulrike Heitmann, Nima Huschmand, Frank Dimroth, Jonas Bartsch, David Lackner
On the route to a high efficiency glued tandem solar cell fabricated using a ZnO-based transparent conductive adhesive, several challenges were encountered. By lowering the pressure during the annealing of the adhesive to 0.3 or 1 kg/cm2, the III-V s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::78bdd2993bb6a95ca5d2e56f9e4b0382
Autor:
Hubert Hauser, Oliver Höhn, David Lackner, Ulrike Heitmann, Jonas Bartsch, Stefan Janz, Felix Predan, Richard Hermann, Frank Dimroth, Sven Kluska
Publikováno v:
2020 47th IEEE Photovoltaic Specialists Conference (PVSC)
By adjusting the process flow of a newly developed transparent conductive adhesive (TCA), the first mechanically stable interconnection of a glued III-V on Si tandem solar cell was established utilizing a ZnO-based adhesive. The measured $V_{OC}$ of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4db2fa36038790637b91fb87f4316590
https://doi.org/10.1109/pvsc45281.2020.9300646
https://doi.org/10.1109/pvsc45281.2020.9300646
Publikováno v:
15th International Conference on Concentrator Photovoltaic Systems (CPV-15)
This work presents the results of the electrical and optical characterization of a new transparent conductive adhesive (TCA) that combines the techniques of spray pyrolysis and a sol-gel like process. This approach is of particular interest since the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b79b7129fcbb43428745b7384ba5f885
Publikováno v:
Polymer Testing. 81:106164
A simple experimental setup for temperature dependent mass spectrometric measurements has been constructed. It consists of a heated sample chamber and a mass spectrometer and allows for measurements under inert gas and ambient air. Based on initial m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::500019546e2a730ab9f39ce7c97952d2
https://doi.org/10.1016/j.polymertesting.2019.106164
https://doi.org/10.1016/j.polymertesting.2019.106164
Autor:
Oliver Höhn, Sven Kluska, David Lackner, Ulrike Heitmann, Richard Hermann, Jonas Bartsch, Stefan Janz, Stefan W. Glunz, Hubert Hauser
Publikováno v:
IEEE Journal of Photovoltaics
This work presents a new type of transparent conductive adhesive and its electrical and optical properties with regards to an application in III–V on Silicon tandem solar cells. The developed adhesive is based on a doped ZnO and deposited by spray
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0841eb61fc8f7b3eb39589df6a81416b
Publikováno v:
2018 IEEE 7th World Conference on Photovoltaic Energy Conversion (WCPEC) (A Joint Conference of 45th IEEE PVSC, 28th PVSEC & 34th EU PVSEC)
The currently used options for the monolithic interconnection of sub-cells in a Si and III-V tandem solar cell device are direct wafer-bonding or hetero-epitaxy. Both methods are costly and difficult to transfer into an industrial process. This work
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3e4314f154d0538aa25fb8393260a88f