Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Ulli Hansen"'
Autor:
Ulli Hansen, Martin Schneider-Ramelow, Thomas Galler, Michael Schiffer, Dzmitry Starukhin, Tobias Chaloun, Norbert Ambrosius, Christian Waldschmidt, Malte Schulz-Ruhtenberg, Winfried Mayer, Kevin Krohnert, Georg Friedrich, Markus Wohrmann
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
In this work, we present the realized versatile hermetically sealed sensor packaging platform based on glass interposers which is applicable in industrial metrology, MEMS, photonics, life sciences and process automation application, among others. The
Publikováno v:
Light-Emitting Devices, Materials, and Applications XXIV.
Packaging materials usable for DUV-LEDs are limited as most organic materials are affected by DUV radiation. Packages used are TO-packages or 3D-structured ceramic housings with quartz lid. Due to DUV-LEDs radiating up to 50% of their light to the si
Autor:
Oliver Gyenge, Ha-Duong Ngo, Piotr Mackowiak, Simon Maus, Bei Wang, Manuel Baeuscher, Yucheng Zhang, Oswin Ehrmann, Klaus-Dieter Lang, Ulli Hansen, Xiaodong Hu
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Anodic bonding technology is a well-established industrial technique, which is reported to be the most widely used MEMS packaging method. This Paper studies residual stress issue caused by different coefficients of thermal expansion (CTE) between sil
Autor:
Martin Schneider-Ramelow, Simon Maus, Ha-Duong Ngo, Oswin Ehrmann, Piotr Mackowiak, Ulli Hansen, Yucheng Zhang, Klaus-Dieter Lang, Xiaodong Hu, Maozhou Meng, Oliver Gyenge
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
In the present work, an intermediate sodium-rich glass layer was deposited on silicon wafer by a PVD (Physical Vapor Deposition) process for further silicon to silicon anodic bonding. The anodic bonding process was carried out at low direct-current v
Autor:
Ha-Duong Ngo, Oswin Ehrmann, Ulli Hansen, Oliver Gyenge, Piotr Mackowiak, N. Vokmer, Xiaodong Hu, Klaus Dieter Lang, Maozhou Meng, Simon Maus, Manuel Baeuscher, Biswajit Mukhopadhyay
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
The anodic bonding technology is a well-established industrial technique, which has been reported to account for the mainstream packaging methods in Micro-Electro-Mechanical-Systems (MEMS) devices, such as hermetic sealing, encapsulation, and wafer l
Autor:
Manuel Bauscher, Martin Ihle, Piotr Mackowiak, Ha-Duong Ngo, Klaus-Dieter Lang, Ulli Hansen, Biswajit Mukhopadhyay, Xiaodong Hu, Steffen Ziesche, Yucheng Zhang, Oliver Gyenge, Hans Walter, Simon Maus, Oswin Ehrmann, Ole Hoelck
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
This work helps to clarify the effects on bondable Low Temperature Cofiered Cofired Ceramic(LTCC) material from Fraunhofer IKTS under different bonding conditions as changes in temperature, voltage and time. The Paper investigates silicon bonded to L
Autor:
Daniel Studzinski, Ulli Hansen, Kwong-Loon Yam, Kok-Kheong Looi, Dzafir Shariff, Ralph Wilke, Juergen Leib, Volker Seidemann, Ha-Duong Ngo, Kenneth Tan, Florian Bieck, Nathapong Suthiwongsunthorn, Michael Topper
Publikováno v:
IEEE Transactions on Advanced Packaging. 33:713-721
Through-silicon-via (TSV) interconnects using the "via-last" approach are successfully applied for wafer-level packaging of complementary metal-oxide-semiconductor (CMOS) image sensors. Standard materials and processes are applied for redistribution
Publikováno v:
Procedia Chemistry. 1(1):76-79
The use of a plasma-assisted e-beam evaporation process enables a cost-efficient exploitation of the outstanding material properties of borosilicate glass – a chemically very inert material with minimal moisture absorption, excellent optical proper
Publikováno v:
Analog Integrated Circuits and Signal Processing. 40:131-140
The large variety of the technologies and physical, chemical or biochemical effects united in micro systems requires a new generation of quality assurance. An appropriate quality management should check all conceivable influences on the product and p
Publikováno v:
tm - Technisches Messen. 70:244-250
In diesem Beitrag wird BICEPS präsentiert, ein T-CAD-Werkzeug zur Unterstützung im Mikrosystementwurf. Ursprünglich zur Steuerung des Kontrollflusses im Entwurfsprozess nasschemisch geätzter Siliziumkomponenten konzipiert, wurde es um ein regelba