Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Ujjwal Pasupulety"'
Publikováno v:
AIKE
The recent success of the application of Artificial Intelligence in the financial sector has resulted in more firms relying on stochastic models for predicting the behaviour of the market. Everyday, quantitative analysts strive to attain better accur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7c518a7e8acff31f6bae4a87818c359
https://doi.org/10.1109/aike.2019.00045
https://doi.org/10.1109/aike.2019.00045
Publikováno v:
Advances in Intelligent Systems and Computing ISBN: 9783030166564
ISDA (1)
ISDA (1)
Network security plays a critical role in today’s digital system infrastructure. Everyday, there are hundreds of cases of data theft or loss due to the system’s integrity being compromised. The root cause of this issue is the lack of systems in p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3a74ae927eccffc63da87a71f2f3e86
https://doi.org/10.1007/978-3-030-16657-1_90
https://doi.org/10.1007/978-3-030-16657-1_90
Publikováno v:
Communications in Computer and Information Science ISBN: 9789811513831
The Run Length Encoding (RLE) algorithm substitutes long runs of identical symbols with the value of that symbol followed by the binary representation of the frequency of occurrences of that value. This lossless technique is effective for encoding im
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2e36759ca2be1090ecbe43510c9ce54
https://doi.org/10.1007/978-981-15-1384-8_5
https://doi.org/10.1007/978-981-15-1384-8_5
Publikováno v:
ISED
Through-Silicon Vias(TSVs) are a type of on-chip interconnect used for communication between multiple layers of circuit elements in a 3D IC. Multiple TSVs form a vertical link connecting inter-layer elements in 3D Network-on-Chip(NoC) architectures.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92547e2eca6ec8b80078e22c520e36c0
https://doi.org/10.1109/ised.2018.8704109
https://doi.org/10.1109/ised.2018.8704109
Publikováno v:
ICACCI
A Through Silicon Via(TSV) interconnects vertically stacked layers of circuit elements in a 3D IC. This leads to reduced distance and increased communication bandwidth between any two circuit elements located on different layers of the chip compared
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a87861c226cee5d0130273f885c6dd08
https://doi.org/10.1109/icacci.2018.8554639
https://doi.org/10.1109/icacci.2018.8554639
Publikováno v:
Simulation Modelling Practice and Theory. 96:101929
With the increase in number and complexity of cores and components in Chip-Multiprocessors (CMP) and Systems-on-Chip (SoCs), a highly structured and efficient on-chip communication network is required to achieve high-performance and scalability. Netw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6db7117714a29a08398dba62dcb6021a
https://doi.org/10.1016/j.simpat.2019.101929
https://doi.org/10.1016/j.simpat.2019.101929