Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Uisub Shin"'
Autor:
Uisub Shin, Cong Ding, Bingzhao Zhu, Yashwanth Vyza, Alix Trouillet, Emilie C. M. Revol, Stephanie P. Lacour, Mahsa Shoaran
Publikováno v:
IEEE Journal of Solid-State Circuits. 57:3243-3257
Closed-loop neural interfaces with on-chip machine learning can detect and suppress disease symptoms in neurological disorders or restore lost functions in paralyzed patients. While high-density neural recording can provide rich neural activity infor
Publikováno v:
2022 IEEE Custom Integrated Circuits Conference (CICC).
Autor:
Uisub Shin, Laxmeesha Somappa, Cong Ding, Yashwanth Vyza, Bingzhao Zhu, Alix Trouillet, Stephanie P. Lacour, Mahsa Shoaran
Publikováno v:
2022 IEEE International Solid- State Circuits Conference (ISSCC).
Publikováno v:
IEEE Trans Biomed Circuits Syst
The application of closed-loop approaches in systems neuroscience and therapeutic stimulation holds great promise for revolutionizing our understanding of the brain and for developing novel neuromodulation therapies to restore lost functions. Neural
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4b0ffa237600ab8a5ce0e212e22f62e3
Publikováno v:
ICECS
Neural interfaces capable of multi-site electrical recording, on-site signal classification, and closed-loop therapy are critical for the diagnosis and treatment of neurological disorders. However, deploying machine learning algorithms on low-power n
Publikováno v:
SPIE Proceedings.
This paper proposes a read-in integrated circuit (RIIC) for infrared scene projectors, which compensates for the voltage drops in ground lines in order to improve the uniformity of the emitter current. A current output digital-to-analog converter is
Publikováno v:
SPIE Proceedings.
The infrared scene projector (IRSP) is a tool for evaluating infrared sensors by producing infrared images. Because sensor testing with IRSPs is safer than field testing, the usefulness of IRSPs is widely recognized at present. The important performa
Publikováno v:
IEICE Electronics Express. 15:20180182-20180182
Publikováno v:
IEICE Electronics Express. 15:20188007-20188007