Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Ugur Kesen"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:933-940
Traditional printed circuit board (PCB) laminates such as FR4 types are formed using epoxy resin and glass fiber. The most important problem with waste PCB laminates is that their recycling cycle is too long. Herein, we aimed to show whether it is po
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::185695979b6a3b5c337b52fad28ec184
https://doi.org/10.1109/tcpmt.2020.2988456
https://doi.org/10.1109/tcpmt.2020.2988456
Autor:
Ugur Kılıç, Ugur Kesen
The globalizing world, the rapid increase in industrialization and urbanization rates have increased the world’s need for energy day by day, making energy one of the most important agenda items of the world. Increasing demand has led the countries
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3355b7947a3846fd32c79786ba55cfa5
https://hdl.handle.net/11424/284118
https://hdl.handle.net/11424/284118
Publikováno v:
Computer Applications in Engineering Education. 27:1419-1428
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43adbfccb5092d29357a98cca7fdd432
https://doi.org/10.1002/cae.22159
https://doi.org/10.1002/cae.22159
Autor:
Kesen, Ugur, Alsan, Sezgin
Publikováno v:
Journal of Mechatronic & Artificial Intelligence in Engineering; Jun2024, Vol. 5 Issue 1, p66-71, 6p
Autor:
Kılıç, Ugur1, Kesen, Ugur2 ugurkilicytu@gmail.com
Publikováno v:
Journal of Engineering Research (2307-1877). Mar2022, Vol. 10 Issue 1A, p227-236. 10p.
Publikováno v:
Conference Proceedings of the International Symposium on Innovative Technologies in Engineering & Science. 2014, p715-721. 7p.
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology; Jun2020, Vol. 10 Issue 6, p933-940, 8p